AVS2001 Session AT-TuA: Sustainable Climate-Friendly Semiconductor Manufacturing

Tuesday, October 30, 2001 3:00 PM in Room 111

Tuesday Afternoon

Start	Invited?	Item
3:00 PM		AT-TuA-4 Sustainable Semiconductor Manufacturing: Methods and Applications to Reduce the Environmental Impact of Chip Making S. Raoux, D. Ho, R. Smati, M. Alaoui, P. Porshnev, T. Francis (Applied Materials) The semiconductor industry is pursuing aggressive programs to reduce the environmental impact of its manufacturing processes. Great progress has been made in the area of global warming perfluorocompound (PFC) emissions: Technologies have been developed that can provide up to two orders of magnitude lower emissions from Etch and CVD chamber cleaning, compared to the processes of records of just a few years ago. Much can be learned from the strategy that was adopted to find solutions to the PFC problem. First, environmentally friendly technologies must conciliate process performance and economic viability. Second, one must realize that industrial processes are not developed in isolation from their surroundings but are rather part of an overall industrial ecosystem. This mind set is steadily gaining ground as business studies realize the gain in productivity that can be made by implementing green technologies. Here we review some methods and applications currently used in the semiconductor equipment industry to assess and reduce gas consumption and emissions, reduce solid waste and conserve energy and water resources.
3:20 PM		AT-TuA-5 Reducing PFC Emissions from a Semiconductor Wafer Fab: Optimization of Chamber Clean Processes for the CVD Tool Set A.D. Johnson (Air Products and Chemicals, Inc.); C. Deuper (Philips Semiconductor, The Netherlands) Perfluorocompound (PFC) gases (e.g., CF4, C2F6, and NF3) are used extensively in semiconductor manufacturing for cleaning CVD chambers following thin film deposition. PFCs, however, have large global warming potentials (GWPs) and are suspected of contributing to global climate change. Responding to this concern, the global semiconductor industry has voluntarily agreed to minimize its PFC emissions. Reduction targets for the US, Europe and Japan are 10 % of 1995 levels by the year 2010. Achieving these targeted reductions requires all processes using PFCs be optimized. Process optimization involves reducing emissions, and usage, of PFCs while maintaining the same, or reducing, the cycle time. This report describes how optimized chamber clean processes were identified for the CVD tool set.
3:40 PM		AT-TuA-6 AMD's Global Climate Protection Plan R. Content (AMD)