ALD/ALE 2025 Session AM2-WeA: ALD Equipment II

As the demand for miniaturized and complex devices accelerates across industries, innovative and precise atomic layer advanced manufacturing techniques have become critical. ATLANT 3D’s proprietary Direct Atomic Layer Processing (DALP™) technology is redefining thin-film processing by enabling spatially localized, atomically precise material growth with unmatched flexibility. Building upon Atomic Layer Deposition, DALP™ confines gas flows to a micrometer-scale area using advanced microreactors, enabling deposition of diverse materials on complex geometries and substrates with exceptional thickness control and conformality on complex structures.

DALP™ technology tackles key challenges in accelerating innovation within thin-film manufacturing. It enables rapid prototyping by allowing localized, multi-thickness depositions of diverse materials on a single wafer, significantly cutting prototyping timelines from months to hours compared to conventional methods.These capabilities have been demonstrated across diverse applications, including optics and photonics, MEMS, RF electronics, emerging memory technologies, advanced packaging, and energy storage.

This talk will explore ATLANT 3D’s advancements in DALP™ technology, focusing on expanded material compatibility, enhanced resolution, and new opportunities it creates for thin-film processing. We will demonstrate how DALP™ technology drives innovation by enabling the fabrication of complete, functional devices. Through case studies, we will highlight how our advanced processing technique have been used to produce components and electronic devices. These examples illustrate how ATLANT 3D’s platform not only improves material deposition processes but also revolutionizes prototyping and manufacturing, empowering industries to achieve faster and more efficient innovation.