ICMCTF2005 Session BP: Symposium B Poster Session

Thursday, May 5, 2005 5:00 PM in Room Town & Country

Thursday Afternoon

Time Period ThP Sessions | Topic B Sessions | Time Periods | Topics | ICMCTF2005 Schedule

BP-1 Tribological Enhancement of CrN Coatings by Metal Plasma Ion-Implantation of Vanadium and Carbon Ions
K.-W. Weng, D.-Y. Wang (Mingdao University, Taiwan)
The chromium nitride coating has been widely used in precision forming and molding applications for to its excellent oxidation resistance and tribological and oxidation properties. To further improve the wear performance of CrN coatings, vanadium and carbon ions were introduced into the near surface layer of as-deposited CrN coatings by using a metal-plasma ion implantation (MPII) process. The underlying dense and smooth CrN coating was deposited by using a filtered arc deposition (FAD) system, which provides fully ionized Cr plasma to the substrate surface. The subsequent surface irradiation of the CrN coating with vanadium and carbon ions resulted in further densification and alloy formation at the near surface. The correlation between the implantation parameters and the wear resistance, corrosion resistance, and fracture toughness will be address by tribological and mechanical examination.
BP-3 Influence of the Aluminum Content on the Cr1-xAlxC Thin Films Properties by Unbalanced Reactive Magnetron Sputtering on the High-Speed Steel
G.-W. Li, T.-C. Fu, C.H. Hsieh (National Kaohsiung First University of Science and Technology, Taiwan)
The thin films were deposited on the high-speed steel by unbalanced reactive magnetron sputtering in a mixed Ar/C2H2 atmosphere and the depositions were performed at a total pressure of 0.4Pa. The targets were composed of three Cr and one Al and each target was operated in D.C. mode. In this study, we aimed to find out the influence of the aluminum content in Cr1-xAlxC on the films properties. With this study, we found the films had a fine columnar grain structure and when the x=0.13 in Cr1-xAlxC, we found some characters, such as hardness reached Hv1660, with lower friction coefficient in 0.49 by wear test against with chromium steel pin and good surface energy at wetting angle in 86°. Those properties are better than the uncoated substrate. However, the film hardness has the inverse relationship with the aluminum content. And when the aluminum content increased can reduce the friction coefficient and increase the wetting angle which means higher Al content can improve the lubricity and increase wear resistance of the films, and by annealing the thin films above 923°K, the films will form a dense protective film of complex Cr2O3 and α-Al2O3 oxides, which finally will increase the high-speed steel use life.
BP-4 Deposition of SiOxNy Films by PE-CVD for OLED Passivation
J.H. Lee, C.H. Jeong, S.J Kyung, G.Y. Yeom (Sungkyunkwan University, South Korea)
Recently, organic-based display devices such as organic thin film transistors (OTFTs) and organic light emitting diodes (OLEDs) are widely investigated due to the flexibility of the devices, light weight, etc. Progress in this field has led to the realization of OLEDs with power efficiency and color tunability that are adequate for commercialization. However, one of the major problems of these organic-based devices is short device lifetime and one of the reasons is caused by the permeation of H2O and O2 during the exposure to the air. To prevent the permeation of H2O and O2 to the devices, the encapsulation of the devices such as metal encapsulation and glass encapsulation are currently used for OLED devices, however, thin film passivation instead of the encapsulation on these devices are preferred for the lighter weight, wider viewing angle, flexibility, etc.. SiOxNy film is one of the widely used dielectric materials used in the solid state electronic and optoelectronic devices as insulators, waveguides, defect passivation etc.. In this study, using hexamethyldisilazane (HMDS) /NH3/O2/N2 gas mixtures, SiOxNy thin films were deposited on plastic substrates at a low temperature using a PECVD method and its properties were investigated. We will report the film deposition rate, film crystallization, chemical composition, H2O and O2 permeation, and optical transmittance of the deposited films measured using an alpha-step, XPS, FT-IR, ellipsometer, and UV spectrometer, respectively .
BP-5 Deposition of (Ti,Cr)N-MoS2 Thin Films by D. C. Magnetron Sputtering
S.K. Kim, J.H. Kim (University of Ulsan, Korea)
As technology advances, there is a demand for development of hard, solid lubricant coatings. (Ti,Cr)N-MoS2 films were deposited on SKD11 tool steel substrate by codeposition of MoS2 with (Ti,Cr)N using a D. C. magnetron sputtering process. The influence of the interlyer thickness, the N2/Ar gas ratio, the deposition temperature, the amount of MoS2 in the film, and the bias voltage on the mechanical and the structural properties of the films were investigated. The critical load increased with the (Ti,Cr) interlayer thickness. The hardness of the film increased with the decrease of the nitrogen content in the gas and with the increase of the deposition temperture. Wear and scratch tests were performed on thin films deposited in various conditions.
BP-6 The Effect of Nitrogen Ion Implantationon the Corrosion Behaviour of Stainless Steels in Chloride Media
L. Martínez, F.J. Pérez, C. Gómez (Universidad Complutense de Madrid, Spain)
In this work, the effect of Nitrogen implantation on the corrosion behaviour of an austenitic (AISI 304) and a ferritic (AISI 430) stainless steels is studied. With this purpose, doses ranging from 1x1014N2+/cm2 to 1x1017N2+/cm2 at an energy of 80keVwere tested by means of polarization resistance and Tafel extrapolation. The results showed that, in general terms, N implantation increased the polarization resistance and polarise the anodic reaction of the corrosion process. Both factors revealed an improvement in the protective properties against corrosion of both stainless steels, even though certain differences in the effect of N implantation could be distinguished in each stainless steel. The results obtained will be compared with Electrochemical Impedance Spectroscopy (EIS) measurements.
BP-7 Deposition of Silicon Dioxide Films for Large Area Flexible Electronics using a Modulated Electron Beam Generated Plasma
D. Leonhardt, S.G. Walton (US Naval Research Laboratory)

Electron beam (e-beam) ionization is an efficient method of producing plasma and is readily scalable to large area (square meters). Furthermore, ionization and dissociation by e-beams is not limited to low energy threshold processes as in conventional materials processing plasmas, and therefore provides wider chemistry domains than typical pulsed or continuous plasma deposition tools. NRL has developed multi-kilovolt e-beam sheets to generate similarly sized (up to 1/2 square meter) high density plasmas (1010-1012 cm-3) that possess low electron temperatures (<0.5 eV) and allow unique chemistries due to the e-beam plasma generation mechanism. These systems have been used to deposit films of silicon dioxide for use in flexible electronics as the primary dielectric and barrier layer, from mixtures of TEOS and oxygen precursors in multiple configurations. The film electrical and optical properties with respect to gas mixtures, substrate type, temperature and ion energy with the characterization of the plasma environment (using in situ time-resolved electrostatic probes and mass spectrometry) will be presented. Subsequent steps to optimize and more fully understand the deposition process in these plasma systems will also be discussed. The deposition of additional films pertinent to flexible electronics (amorphous Si and SiNx) will also be presented and discussed.

Work supported by the Office of Naval Research.

BP-8 Deposition of Multicomponent Chromium Boride Based Coatings by Pulsed Magnetron Sputtering of Powder Targets
M. Audronis (University of Salford and The University of Sheffield, United Kingdom); P.J. Kelly, R.D. Arnell (University of Salford, United Kingdom); A. Leyland, A. Matthews (The University of Sheffield, United Kingdom)

Composite transition metal boride (and also nitride or carbide) based materials with special properties show great promise for a wide range of tribology applications. For example, the wear and friction properties of PVD hard films can in some cases be enhanced significantly by introducing some amount of solid lubricant material into the coating. Complex multi-element composite materials are able to combine the advantages of several constituent phases to survive under varying wear conditions - by exhibiting "adaptive" or "chameleon" properties.

Sputtering of multi-component coatings from blended powder targets offers an easy, rapid and cost-effective way of varying the elemental composition of the target and hence of the deposited film. It also solves some overheating problems associated with the sputtering of brittle ceramic targets. Furthermore, pulsed magnetron sputtering can have a significant beneficial impact on PVD coating structure and properties.

In this study, high quality multicomponent chromium boride based coatings, with Ti, C and MoSX alloying additions, were deposited by pulsed magnetron sputtering of blended powder targets. The results of investigations of structure, composition, mechanical & tribological properties and corrosion resistance of these coatings are presented.

BP-9 Microstructure and Mechanical Properties of Ti1-xAlxN/a-Si3N4 Nanoscale Multilayered Coatings Prepared by D.C. Magnetron Sputtering
J.-K. Park, Y.-J. Baik (Korea Institute of Science and Technology, South Korea)
TiAlN coating has been used for machining application, due to the high hardness and oxidation resistance. Recently, Ti(-Al)-Si-N nanocomposite coatings were known to have excellent hardness and high temperature stability, compared to the TiAlN coatings. However, the mechanical properties of the nanocomposite coatings prepared by codeposition of TiN and Si-N phases are critically dependent on the Si content accompanied by microstructure change. In this study, we have investigated the microstructure and hardness of Ti1-xAlxN/a-Si3N4 nanoscale mulilayered coatings. The Ti1-xAlxN/a-Si3N4 nanoscale mulilayered coatings were deposited on M2 HSS and Si wafer by D.C. magnetron sputtering with two Ti1-xAlx alloy and Si targets. Reactive gas was N2-Ar.The period of nanomultilayer was controlled by changing rotation speed of substrate holder. For a fixed rotation speed, the relative thickness of the amorphous Si3N4 phase was also controlled by changing Si target power density. The phase, microstructure, hardness of the obtained coatings were checked. The effect of bilayer period and relative thickness of amorphous Si3N4 on the phase, microstructure, hardness of the Ti1-xAlxN/a-Si3N4 nanoscale mulilayered coatings will be discussed.
BP-10 Modification of Maize Starch Films by Plasma Deposition
R.M.S.M. Thire (UFRJ, Brazil); R.A. Simao (Coppe - UFRJ, Brazil); C.T. Andrade (UFRJ, Brazil); C.A. Achete (Coppe - UFRJ, Brazil)
Due to low cost and excellent biodegradability, the use of starch as raw material for bioplastic production is growing in interest. However, the hydrophilic character of starch is an important drawback for its industrial scale production since the properties of starch-based films are significantly influenced by relative humidity during their use and storage. In this work, thermoplastic maize starch films were coated by plasma technology with a protective thin layer in order to reduce water sensitivity. Conditions such as high base pressure before the introduction of the working gas and mild deposition parameters were employed. 1-Butene was used as monomers for plasma polymerisation. Glycerol-plasticised cast starch films prepared from starch suspensions that had been heated under reflux for different periods of time were used as substrate. Coated films presented a reduction of water absorption up to 90% and increase in contact angle related to water. Water contact angles greater than 90 degrees were obtained. These results indicated that the coating process reduced significantly the hydrophilic nature of the starch-based materials.
BP-11 Gas Sensing Properties of SnO2 Thin Films Prepared by E-Beam Evaporation Technique
A. Khanna (University of Arkansas); R. Kumar (Khalsa College, India); D.G. Bhat (University of Arkansas)
SnO2 thin films were prepared by e-beam evaporation of Sn in high vacuum conditions and the subsequent oxidation of the metallic films in oxygen flowing conditions. The electrical properties of SnO2 films were studied by a two probe method of resistivity measurement in the temperature range of 50-225°C. On exposure to H2S gas, the resistance of the SnO2 thin films decreased significantly. The H2S sensor signal of the thin film elements was measured at four operating temperatures. It was observed to decrease with the increase in the sensor operating temperature, while both the response and recovery times improved with temperature. The sensor element was selective to hydrogen sulfide and did not show any senstivity to ethanol and hydrogen.
BP-12 Interfacial Thermally Activated Relaxations and Thermal Stability of Superhard nc-TiN/a-Si3N4 and nc-(TiAl)N/a-Si3N4 Nanocomposites Studied by Means of Internal Friction Measurements
S.Z. Li (Qingdao University of Science and Technology, China); Q.F. Fang, Q. Liu (Chinese Academy of Sciences, China); J. Gao (Chengdu Tool Research Institute); P. Nesladek, J. Prochazka, P. Karvankova, M.G.J. Veprek-Heijman, S. Veprek (Technical University Munich, Germany)
We investigated the processes that are responsible for the relaxation of nanostructure and/or self-hardening of superhard nc-TiN/a-Si3N4 and nc-(Ti1-xAlx)N/a-Si3N4 nanocomposites upon annealing in nitrogen, using the internal friction measurements by means of torsion pendulum and vibrating reed method. It is shown that stable nanocomposites, which were deposited under conditions of a sufficiently high nitrogen pressure and temperature, in a plasma of intense glow discharge (power density at the surface of the growing film about 2 - 3 W/cm2), have a constant value of hardness (measured at room temperature after each annealing step) up to 1100°C, and show no internal friction peak up to a temperature of 800°C achievable in our internal friction measurements. In contrast, the unstable coatings that were deposited at a low temperature and/or low nitrogen pressure or low plasma density show self-hardening and a distinct internal friction peak with well defined activation energy. This peak is due to thermally activated processes within the grain boundaries of the nanostructure whose formation due to phase segregation was not completed during the deposition. Upon the annealing to ≥700°C, the phase segregation is completed, the hardness increases and remains stable up to 1100°C, and the internal friction peak vanishes.
BP-13 Studies on the Low Dielectric SiOC(-H) Thin Films Deposited using MTMS and Oxygen as Precursors by UV Source Assisted PECVD
K. Meera, C.S. Yang, C.K. Choi (Cheju National University, South Korea)
As the feature size of the integrated circuits is scaled down into the deep submicrometer region, dielectric materials with lower k values are needed to reduce the wiring capacitance and improve the device performance. Among the low-k films, silicon oxycarbide (SiOC(-H)) films are important for applications in advanced Cu interconnects. In this study, SiOC(-H) films were deposited on a p-type Si(100) substrate using MTMS and O2 as precursors in a radio frequency (13.56 MHz) by UV source assisted plasma enhanced chemical vapor deposition (PECVD) system. The films were deposited using different flow rates of MTMS and oxygen for an RF power of 300 W and annealing of the film was carried out. FTIR spectroscopy studies were carried out in the absorbance mode in the range of 400 to 4000 cm-1 which showed the various bonding configurations such as Si-O-Si(C), Si-CH3, -OH, CHx bonds in the films. The annealing induces the re-arrangement of chemical bonds in the films. The chain of Si-O-Si links is broken, and they change to Si-O-C bonds (ring and open links) by the incorporation of the carbon atomic species. The X-ray photoelectron spectroscopic studies has been carried out to study the binding energies of Si-C, O-Si-O, C-H and C-O bonds in the as-deposited and annealed films. The refractive index of the as-deposited films decreases with increase in the flow rate ratio from 1.56 to 1.5 and that of annealed film also decreased from 1.58 to 1.47. The dielectric constant of the SiOC(-H) films were investigated using a metal insulator semiconductor (MIS, Al/SiOC(-H)/p-Si) structure at 1 MHz frequency and the lowest dielectric constant achieved with MTMS/O2 precursor is found to be 2.39.
BP-14 Decorative and Functional Coatings on Aluminium Alloys by Plasma Electrolysis
T. Pilkington, A.L. Yerokhin, A. Leyland, A. Matthews (The University of Sheffield, United Kingdom)
Plasma electrolytic oxidation (PEO) is a process for the surface treatment of Aluminium alloys and valve metals with the objective of formation of a hard abrasion resistant and corrosion resistant oxide ceramic coating. In the industrial applications of PEO coatings there is a requirement for a more complete range of colourways than currently available. Conventional PEO coatings on aluminium alloys ,based on silicate electrolytes, are pale gray to yellow, lower reflectance may be adjusted by use of chromate or manganate electrolyte additins to provide gray to black coatings. This work reports the incorporation of coloured oxide compounds to extend the chromaticity of PEO layers by using either suspensions or soluble ionic species to modify PEO layer composition. The morphology of the coatings produced are characterised by optical microscopy and SEM. Phase composition was investigated by XRD and chromaticity was measured using colourphotospectometer. The coating thickness was determined using an anodizing thickness probe. The mechanical properties were characterised by vickers microhardness and scratch adhesion testing.
BP-15 Thermionic Electron Emission Enhancement of PZT Thin Films Sputter Deposition
Y.F. Lan, T.Y. Guo, J.C. Chang, W.L. Chang, J.L. He (Feng Chia University, Taiwan)
In recent years, micro-electromechanical systems (MEMS) have been widely investigated for the demanding of intelligent sensor or actuators. Lead zirconate titanate (PZT) films are supposed to be applied in many ferroelectric devices of MEMS such as micro-actuators, sensor, and ultrasonic motors. To deposit high quality PZT films is necessary with however constrained by the high deposition temperature of 600-800°C to obtain ferroelectric perovskite structure. This could be detrimental to the end device such as inducing thermal stress or inter-diffusion between electrode layer and PZT layer. Progress has been made to obtain PZT thin film at low deposition temperature using PZT growth on seed layer, laser ablation and rapid thermal annealing etc. In this study, the PZT thin films were deposited by using a dual-target (PZT/PbO) sputter deposition system with intensified plasma enhanced by using thermionic electron emission technique. The deposition temperature is expected to be decreased while maintaining high quality PZT thin film. The influence of the intensified plasma to the microstructure of deposited PZT films will be investigated and correlated to its ferroelectric properties. The results show that with the thermionic enhancement, the deposition temperature requirement to obtain perovskite structure can be lowered to 550°C, and the film growth rate is increased to 1.72 times. The polarization values of PZT thin film deposited without and with thermionic emission configuration are Pr=13 microC/cm2, Ps=31 microC/cm2 and Pr=18 microC/cm2, Ps=45 microC/cm2 respectively. This strongly suggests the possibility of ultizing thermionic enhanced plasma to obtain high quality PZT thin films at lower deposition temperature.
BP-16 Effects of Si Addition on the Characteristic Evolution and Syntheses of Nanocomposite Cr-Si-C-N Coatings Prepared by a Hybrid Coating System
J.H. Jeon, C.S. Jang, K.H. Kim (Pusan National University, South Korea)
Quaternary Cr-Si-C-N coatings were deposited on WC-Co substrates by a hybrid system of arc ion plating (AIP) and sputtering techniques using Cr and Si targets in an Ar/N2/CH4 gaseous mixture. Our Cr-Si-C-N coatings with Si content of 9.2 at.% had a fine composite microstructure comprising nano-sized crystallites of Cr(C,N) surrounded by amorphous phase of Si3N4. Micro-hardness value of the Cr-Si-C-N coatings under a load of 25g was ~45 GPa, which was much largely increased one compared with ~25 GPa of Cr-C-N coatings and ~35 GPa of Cr-Si-N coatings. In addition, the average friction coefficient of the Cr-Si-C-N coatings largely decreased with increasing Si content. In this work, the microstructure and mechanical properties of Cr-Si-C-N coatings were systematically investigated using instrumental analyses.
BP-17 Anticorrosion Properties of Oxide Films on Al Produced by Plasma Electrolytic Oxidation in Alkaline Electrolytes with Various Passivating Additions
A.L. Yerokhin, T. Pilkington, A. Leyland, A. Matthews (The University of Sheffield, United Kingdom)
Oxide ceramic coatings produced on Al alloys by plasma electrolytic oxidation (PEO) can be used to protect the metal from corrosion attack in various environments. The performance of PEO coatings depends upon many factors, including coating thickness, phase composition and morphology. The objective of this study was to investigate effects of passivating additions to alkaline electrolyte on anticorrosion performance of PEO coatings in 3.5% NaCl solution. Oxide ceramic coatings were formed for 30 min on BS 6082 Al alloy samples in galvanostatic DC PEO mode at current density 10 A dm-2. Dilute alkaline solution (1 g l-1 of KOH) was used as a base electrolyte to which NaAlO2, Na2SiO3, Na3PO4, KMnO4 or K2Cr2O7 was added with concentration ranged from 0.01 to 0.2 M. The obtained coatings and corrosion products were characterised using SEM, EDX and XRD techniques. Corrosion studies performed using a Solartron 1260A ECI system linked with 1286A potentostat included open circuit potential measurements, potendiodynamic tests and electrochemical impedance spectroscopy. Physical-chemical mechanisms underlying effects of the passivating additions on the corrosion performance of oxide ceramic coatings are discussed.
BP-18 Modification of Photocatalytic AIP-TiO2 Films by Doping Chromium and Nitrogen
J.T. Chang, Y.F. Lai, J.L. He (Feng Chia University, Taiwan)
Titanium dioxide is currently used as photocatalyst due to its semiconductive nature, with however effective only when exposed to UV light. To improve the photocatalytic activity in either UV or visible light range, it was found to modify titanium dioxide by doping third elements could be effective in recent years. In this study, metallic chromium and nonmetallic nitrogen doping elements were incorporated into an arc ion plated titanium dioxide films, respectively. The influences of the dosage were discussed. The surface and cross sectional morphology as well as crystal structure were investigated by SEM and XRD. Chemical states of constituent elements in the deposit were analyzed by XPS. The light absorbance of the deposit in UV-Vis range was determined by UV-visible spectrometer. The photocatalysis-induced decolorization of methylene blue aqueous solution was determined by UV-visible spectrometer as an indication of photocatalytic activity of titanium dioxide deposit to reveal the relationship between elements dosage, film structure, and photocatalytic property. Experimental results show that the amount of anatase phase in the deposit is both decreased by doping these elements until the chromium dosage reaches 30% and nitrogen dosage reaches 50%, over which the deposits would then be amorphized. By doping either chromium or nitrogen, the light absorbance of the deposits shift to visible light range though, the chromium degrades its potocatalysis efficacy, while it promotes photocatalysis efficacy by doping suitable amount of nitrogen. A measurement of photo-induced electrical resistivity change induced by the electron-hole recombination of the deposited film was carried out to explain the effect of element dosage.
BP-19 Low Temperature Plasma Nitriding of Stainless Steel by Saddle Field Neutral Fast Atom Beam Source
M. Rahman, J. Haider, M.S.J. Hashmi (Dublin City University, Ireland)
Nitriding by plasma is a promising method for surface treatment to improve hardness (load bearing capacity), corrosion resistance, wear and fatigue resistance of materials (ferrous and non- ferrous).But in most of plasma nitriding technique, the processing temperature dominated by plasma process parameter and it cannot be controlled independently from the plasma source. In this present work, a low tempareture plasma nitriding on stainless steel substrate was investigated. Nitriding were performed with Saddle field neutral fast atom beam source and an auxiliary heater was used for substrate heating. SEM-EDX, Microhardness tester, Optical Microscopy and X-ray diffraction (XRD) were used to evaluate mechanical and structural properties of nitrided layer. It was found that low temperature plasma nitriding exhibited overall enhanced properties compare to untreated sample.
BP-20 CVD Diamond Deposition on Steel Substrate using Boride Interlayer
F.C. Barbieri, V.J. Trava-Airoldi, E.J. Corat (Instituto Nacional de Pesquisas Espaciais, Brazil)

The main objective of this study is to improve the formation of a viable interface for CVD diamond film growth on steel substrates by the use of a boride interlayer between the steel substrate and diamond coating.

Boronizing is a thermochemical diffusion surface treatment in which boron atoms diffuse into the surface of the samples to form iron boride (FeB and Fe2B). The substrate material used for this study was AISI D2 tool steels and the boronizing was carried out using a salt bath consiting of boron carbide (B4C), alumina (Al2O3), potassium fluoborate (KBF4) and silicon carbide (SiC). Borinding treatments were performed at 850°C and 950°C followed by an annealing procedure in air. Boron concentration, boronizing time, annealing time and temperature were varied to optimize the formation of a Fe2B interlayer.

Diamond deposition was performed in runs of 4 hours using a conventional hot-filament CVD reactor. Diamond deposition was carried out utilizing a fixed CH4 / CF4 / H2 volume ratio of 1.5 / 0.5 / 98.5%, respectively, at a pressure of 50 torr. Substrate temperature was varied to enhance diamond film adhesion on the Fe2B interface. Runs with a higher temperature (around 850°C) during the nucleation process and a lower temperature (around 650°C) during growth resulted in a higher adherence. The CF4 addition enhances the growth conditions at the lower growth temperature.

Cross-sectional metallographic analysis was performed to study the borided interface thickness and structure. The diamond films were characterized by X-Ray diffraction (X-RD), scanning electron microscopy (SEM), micro-Raman spectroscopy (Raman) and the adherences were analyzed by Rockwell C indentation.

BP-21 Combined Nitriding and CNx Coating Deposition in Pulse Plasma Processing
V. Zlatanovic (Batalab, Belgrade); N. Popovic, Z. Bogdanov (Nuclear Science Institute Vinca, Belgrade)
Samples made of steel AISI 1045 and 4140 were duplex treated in both interrupted and continuous pulse plasma processing. Microhardness measurements, optical microscopy, SEM, and XRD analyses revealed the formation of a 400 micrometers thick diffusion zone with gamma prime compound layer on the cross section of 1045 sample, while a 300 micrometers thick diffusion zone and gamma prime + epsilon phase compound zone were found in the case of 4140 sample. The samples were treated 4 hours at 500°C in 75:25% hydrogen-nitrogen mixture. In the second experiment, a continuous processing was applied consisting of pulse plasma nitriding followed by 4 hours pulse plasma treatment in carbon containing gas discharge at 500°C. A very dense, continous overlayer was found on both nitrided and post nitrocarburized samples with relatively smooth topography and good adhesion to nitrided surface. SEM analyses revealed a very fine coating microstructure with the grain size less than 100 micrometers. Except the cementite phase no new polycrystalline phases were detected by CuKalfa radiation diffraction analysis. Both D and G peaks were found in Raman spectra with the integral intensity ratio of D and G peaks exceeding factor 3. The spectra were similar to the spectra of CNx coatings deposited by ICP method, while the surface microhardness of duplex treated samples was close to that of pulse plasma nitrided samples.
BP-22 Pulse Plasma Treatment of Aluminium Alloy Extrusion Dies
J.G. Duh (Faculty of Electrical Engineering, Serbia & Montenegro); V. Zlatanovic (Batalab, Belgrade)
Several surface treatment techniques were applied to improve the performance of complex geometry aluminium extrusion dies. In the laboratory experiments the ability of pulse plasma to enter deeply into small openings of complicated geometry samples made of steel grade H 13 was investigated. It was found that the inner bearing surface of dies can successfully be nitrided by applying pulse plasma with 57 micro seconds on period and 3 micro seconds off period. The optical microscopy and SEM examination revealed the existence of a nitrided zone in the bottom of a 2 mm thick, 12 mm deep opening. The microhardness distribution at different positions on the opening cross section was measured by Vickers's method, while XRD was used for phase identification. The service life of aluminium alloy extrusion dies was investigated by field-testing in production equipment. Three types of die bearing surface treatment were applied: salt bath nitriding, conventional plasma nitriding and pulse plasma nitriding.. The dies made of steel grade H13 were plasma nitrided in conventional and pulse plasma equipment and the number of extrusions of aluminium alloy AA 6063 profiles was used as the tool operation criterion. After testing period, the conventionally plasma treated dies were subjected to pulse plasma nitriding. The number of extrusions between two subsequent nitriding was found to be 1.9 - 3.9 times larger in case of pulse plasma compared to conventional plasma treatment.
BP-23 Investigation of Nanocrystalline Cubic Boron Nitride Thin Films Grown using Ion Beam Assisted Deposition
W Otaño, V.M. Pantojas (University of Puerto Rico at Cayey)
Physical Vapor Deposition methods have been successful in the deposition of cubic boron nitride (cBN) thin films. The success of these methods is a result of their flexibility to provide the necessary energetic bombardment to the growing film, while at the same time providing the necessary substrate temperature and chemistry. Resent efforts have been directed to overcoming the high stress in the c-BN films producing coatings with thickness in excess of 5 microns. This is a technologically important step in order to develop the potential of this material as a result of its excellent mechanical, electrical and optical properties. An ion beam assisted deposition system has been prepared to study the effects of hyperthermal ion bombardment on the growing film. This unique system provides the opportunity to study the effects of different bombarding ion energy distributions on the BN nucleation and growth process. The stress of the growing film is studied with an in-situ sensor in real time mode and correlated with the nucleation mechanisms, and the subsequent nanocrystalline structure. Details of this study and the implications for the production of BN coatings will be presented.
BP-24 Plasma Chemistry of a Nb/Ar/O2 Magnetron Discharge
S. Mráz, M. Wuttig, J.M. Schneider (RWTH Aachen University, Germany)
We have investigated the plasma chemistry of a DC reactive magnetron discharge with a mass energy analyser. We have studied the effect of oxygen partial pressure on the positive and negative ion population of the discharge. The current supplied to the magnetron and the total pressure were kept constant throughout the experiments at 900 mA and 0.8 Pa, respectively. The plasma chemistry is strongly affected by the oxygen partial pressure. As the oxygen partial pressure is increased the formation of oxygen based positive and negative ions is observed. Furthermore, we present evidence for the oxygen partial pressure dependent presence of NbO based clusters, both positively and negatively charged. As the oxygen partial pressure is increased the NbO based clusters become the dominating Nb based ionic species in the plasma. These findings are of relevance for the chemical composition and structure evolution of thin NbOx films.
BP-25 Effect of Ion Irradiation During Deposition on the Structure of Alumina Thin Films Grown by Plasma Assisted Chemical Vapour Deposition
D. Kurapov, O. Kyrylov, J.M. Schneider (RWTH Aachen University, Germany)
Alumina thin films were deposited on hot work steel AISI H11 at a growth temperature of 500 to 600 °C by plasma assisted chemical vapour deposition and were studied with respect to the structure and composition by X-ray diffraction and electron probe microanalysis, respectively. The electrical power density at the cathode was varied from 2.7 to 6.6 W/cm2. Within the investigated process window the following characteristic phases could be identified: γ-alumina and α-alumina as well as mixtures thereof. The alumina phase formation was found to be strongly influenced by deposition temperature and electrical power density at the substrate. It is shown that constitution changes due to a reduction in substrate temperature can be avoided by increasing the electrical power density at the cathode which leads to an increase in both ion flux and ion energy at the substrate surface.
BP-26 Vacuum Arc Deposition of Nanostructured Zirconium-Based Boronitride Films
V. Chapusot (Laboratoire de Science et Génie des Surfaces, France); J.F. Pierson (Pole Universitaire, France); B. Stauder, E. Damond (Bodycote, France); A. Billard (École des Mines Parc de Saurupt, France)

Nanostructured coatings are of increasing importance for mechanical applications due to the rather high level of hardness and low brittleness associated with their nano-sized microstructure. In particular, titanium- or zirconium-based coatings are almost studied in the literature. Among the techniques available to produce such films, reactive arc deposition is suitable because of its efficiency owing to the deposition rate and adhesion of the coatings on their substrates.

Reactive vacuum arc deposition has then been used for deposition of zirconium based boronitride films from Zr-ZrB2 composite targets inserted into a conventional titanium multiarc target and evaporated in argon-nitrogen reactive mixtures. After a short description of the deposition device and of the target geometry, we first compare the reactive evaporation mechanisms depending on the fraction of zirconium diboride into the target. The second part of this paper deals with the chemical and structural characteristics of in relation with their deposition conditions. Finally, surface energy and mechanical properties of the coatings are investigated as a function of their composition and structure and are discussed in relation with potential applications in the field of protection of steel parts against aggressive environment such as in the presence of molten glass.

BP-27 Effects of Boron Contents on Microstructures and Micro-Hardness in CrXAlYN Films Synthesized by Cathodic Arc Method
T. Sato, T. Yamamoto, H. Hasegawa, T. Suzuki (Keio University, Japan)

It is well known that incorporation of Al atoms into TiN and CrN films shows the phase transitions from the cubic to hexagonal structures at certain Al amount. In our previous works, the micro-hardness of cubic-type TixAlyN changed from 20 GPa to 32 GPa, which corresponded to changes in lattice parameters. The CrxAlyN films showed the maximum hardness of 27 GPa with Y=0.6 similar to those of TixAlyN films.

The CrxAlyBzN films were synthesized by the cahodic arc method using Cr-Al-B alloy targets with differing Z values from 0 to 0.2 and investigated the changes in crystal structures, lattice parameter and micro-hardness. The microhardness of CrxAlyBzN films increased from 27(Z=0) to 33 GPa (Z=0.1) corresponding to the decrease in lattice parameter. Further, the XRD measurement showed that the CrxAlyBzN films had the cubic structure without hexagonal segregations up to 900°C.

In this study, microhardenss, microstructures and thermal stability of CrxAlyBZN were characterized based on X-ray and transmission electron microscopy analysis.

BP-28 Properties of Superhard ta-C and c-BN Films
D. Rost, S. Weissmantel, G. Reisse (University of Applied Sciences Mittweida, Germany)
Tetrahedral amorphous carbon (ta-C) films were prepared by alternating pulsed laser deposition and annealing. The microstructural, optical and mechanical properties of those films will be presented and discussed. Films have optical band gaps up to 2.5 eV and low average surface roughnesses. Their Vickers microhardness was measured on 2 µm thick films on WC to be 60 to 90 GPa by using a dynamic indentation method. The Youngs modulus is about 800 GPa and the density some 3.3 g/cm3. Naonocrystalline cubic boron nitride films were prepared by ion-beam-assisted pulsed laser deposition (IAPLD). C-BN growth rates up to 100 nm/min were achieved at relatively low substrate temperatures of 250 °C by using high laser fluences of more than 30 J/cm2. The main advantage of IAPLD for the deposition of c-BN films is that at high laser fluences of 30 to 60 J/cm2 the ratio of ions from the ion beam to ablated atoms and ions necessary for cubic film growth can be reduced strongly, since the ablated boron and nitrogen species themselves have high mean kinetic energies of 130 to 180 eV. The properties of those films will be presented. In particular, the adhesion of films on Si and WC hard metal substrates was investigated by scratch testing in dependence on preparation conditions. Critical loads up to 50 N were achieved by using special h-BN interlayers. Depending on deposition parameters the Vickers microhardness of the c-BN films is in the range of 30 to 45 GPa, the Youngs modulus was measured to be in the range of 430 to 590 GPa, and the density is between 3.0 and 3.3 g/cm2.
BP-29 Study on Characteristics of Stripping TiN Coating by Chemical Solution Method
C.-L. Chang, S.-M. Li, D.-Y. Wang (Mingdao University, Taiwan)
This work is focuses on the etch characteristics of removing TiN coating by using the electrolytic dissociation method. TiN coating was deposited on the stainless steel substrate by a cathodic-arc activated deposition (CAAD) process. Removing solution comprises Hydrogen Peroxide, Sodium Hydroxide and deionized water. The aim of this study is to find the optimum prescription and etching rate of removing TiN coating from substrate. The effects of concentration and prescription on etching conditions of removing TiN thin film are discussed in light of I-V polarization curves by polarization measurements and electrochemical impedance spectroscopy. Surface morphology of etched was analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX).
BP-30 Effects of Substrate Bias on the Reactive Sputtered Zr-Al-N Diffusion Barrier Films
J.-L. Ruan, J.-L. Huang, J.-S. Chen (National Cheng-Kung University, Taiwan); D.-F. Lii (Cheng Shiu University, Taiwan)
Zr-Al-N diffusion barrier films were prepared by DC reactive magnetron sputtering under different substrate bias voltages. Cu films were subsequently sputtered onto the Zr-Al-N films without breaking vacuum. The effects of substrate bias voltage on the deposition rate, composition, microstructure, resistivity and diffusion barrier properties of Zr-Al-N films were investigated. Results indicated that the deposition rate and the content of Al decreased with increasing substrate bias voltages. It was believed that the resputtering effect due to the high-energy ion bombardment on film surface had significantly influenced the deposition rate and film's composition. With the increase of substrate bias voltage, the crystal orientation of films distributed more randomly. The substrate bias also decreased the resistivity and improved the diffusion barrier properties of films. The biased Zr-Al-N films could effectively prevent diffusion of Cu to Si wafer even up to the high temperature of 800°C for 30 minutes.
BP-31 Modeling of Diode Configuration Glow Discharge Impedance Connected to Pulse Power Supply
I. Popovic, V. Rajovic, J.G. Duh (Faculty of Electrical Engineering, Serbia & Montenegro)
The voltage and current waveforms of the nitrogen and nitrogen/hydrogen glow discharges used for plasma nitriding at the total pressure range from 0.1 mbar to 15 mbar were recorded and analyzed concerning the discharge instabilities, glow-to-arc transition, hollow cathode effect and the influence of surface treatment process parameters. It was found that the shape of voltage and current contains the information on normal glow, hollow cathode discharge and arcing. We also performed the scoping of dynamic parameters and static characteristic, in order to obtain information for generator and chamber modeling, to be used in a future process control. The influence of process parameters such as total pressure, cathode temperature and biasing voltage on current-voltage characteristics was also considered. The gas discharge could be modeled as a parallel connection of a resistor and a capacitor, where one could determine actual values of the parameters depending on the type of the chamber, and shape and size of the cathode. The dynamic parameters of the system (time constant) were obtained by scoping of cathode voltage waveforms while generator is switched off, whereas the resistance is extracted from the static discharge characteristics.
BP-32 Amorphization of Ta-Al Films using the Magnetron Sputtering
P.J. Su, C.K. Chung (National Cheng Kung University, Taiwan)
Amorphous films of alloys generally have different properties from the crystalline ones in the microstructure, resistivity and morphology. In this paper, we study the Ta/Al composition ratio effect on the formation of amorphous Ta-Al alloy films, which are used as the heating material in inkjet printhead or micro thermal actuator. Three kinds of atomic composition ratios are prepared by different powers of Ta and Al targets in the reactive magnetron co-sputtering system. The Al power varies from 1 kW to 4 kW and the Ta power is fixed at 2.68 kW. The composition, phase, morphology and resistivity of the Ta-Al films are characterized by grazing incident angle X-ray diffractometer (GIAXRD) and Rutherford backscattering spectrometry (RBS), transmission/scanning electron microscopy (TEM/SEM), atomic force microscopy (AFM) and four-point probe instrument, respectively. The microstructure of Ta-Al film becomes amorphous at medium Al composition ratio of about 50%, while it is crystalline at low Al composition ratio of about 33% and has a preferred orientation at high Al composition ratio of about 67%. The amorphous TaAl film also has better properties than the others. It has the highest resistivity of 163.73©-cm than the others of 125.46 and 120.71©-cm, respectively. It also has the smoothest morphology with average roughness of 0.12 nm than the others roughness of 0.39 and 7.2 nm, respectively. The smooth morphology of TaAl film with high resistivity is good for the application of micro thermal actuator as the heating element.
BP-35 Structure and Mechanical Proerties of Cr-Zr-N Films Synthesized by Closed Field Unbalanced Magnetron Sputtering with Vertical Magnetron Sources
S.Y. Lee, G.S. Kim (HanKuk Aviation Unversity, South Korea); J.H. Hahn (Korea Research Institute of Standards and Science, South Korea)
Chromium nitride films have been used successfully and studied extensively for a long time because of their excellent properties such as high hardness and low friction coefficient as a protective coating material. Besides, compared with TiN films, CrN coatings have an excellent corrosion resistance under severe environmental condition and a superior oxidation resistance up to 800°C. Thus CrN coatings are widely applied in engineering. Recently, the various studies on the improvement of their performance are tried. In this work, the ternary Cr1-xZrxN coatings were synthesized in order to improve the mechanical properties of CrN coating. Coatings were deposited on the substrates of Si(100) wafer and plasma nitrided AISI H13 steel by closed field unbalanced magnetron sputtering with vertical magnetron sources and their structure, crystal phase and mechanical properties as a function of the Zr content were investigated by Auger electron spectroscopy (AES), X-ray diffraction (XRD), X-ray photoelectron spectroscope (XPS), scanning electron microscopy (SEM), nanoindentation, wear and oxidation tests. The Result of nanoindentation test showed that the hardness and elastic modulus of Cr1-xZrxN coatings were increased with increasing the Zr content and the maximum hardness and elastic modulus were measured to be approximately 34 and 410 GPa, respectively. Also, the wear resistance at 500°C was largely increased than that of the CrN coating. Detailed analysis results including the property of oxidation resistance will be presented.
BP-36 Time-Resolved Investigation of an Asymmetric Bipolar Pulsed Reactive Magnetron Discharge
Th. Dunger, Th. Welzel, St. Welzel (Chemnitz University of Technology, Germany); F. Richter (TU Chemnitz, Germany)

Time-resolved investigation of an asymmetric bipolar pulsed magnetron discharge for the deposition of MgO films has been done by Langmuir double probe measurements and optical emission spectroscopy (OES).

The magnetron was equipped with a 4" circular Mg target and operated in an Ar/O2 atmosphere. The discharge was powered by a Pinnacle Plus unit with typically 100 W. Pulse frequencies of 100 - 300 kHz were used. All measurements were made on the axis of symmetry of the discharge.

The Langmuir probe measurements show a typical temporal evolution of the charge carrier density. Immediately after switching the discharge "on" two sharp maxima are observed, before a transition into a stationary state occurs. In dependence on the pulse parameters the height and the temporal position of the extrema are changed. After switching the pulse "off" the charge carrier density decays exponentially with a time constant of 0.5 micros which was practically independent of the pulse parameters.

With OES the most intensive Ar and Mg lines have been measured. Their temporal evolution I(t) was similar to that of the charge carrier density. In particular the exponential decay and the second maximum were confirmed while the first maximum appeared only very weak. A careful comparison showed that different Ar lines may differ significantly in their temporal behaviour. Considering the excitation mechanisms it comes out that the Ar line at 750.4 nm is best suited for a comparison to the charge carrier density. The other lines show broader I(t) traces and larger decay constants. Another interesting feature occurs after switching from "on" to "off", where an additional maximum is observed which may be caused by high energy electrons due to the fast switching potential.

BP-37 ZrAlN Thin Films: Mechanical Properties and Oxidation Resistance
R. Lamni (IPMC-SB-EPFL, Switzerland); R. Sanjines (SB-EPFL, Switzerland); F. Levy (IPMC-SB-EPFL, Switzerland)
Zr1-xAlxN thin films have been synthesized by magnetron sputtering. The solubility limit of Al atoms in the fcc ZrN lattice was found to be x=0.43. Above x=0.43 the films contain a mixture of fcc ZrN and hexagonal AlN phases. In the fcc-Zr1-xAlxN films, the lattice parameter decreases linearly with increasing the Al contend. The texture of these films progressively changes from a preferred (111) orientation into a randomly oriented and the nanohardness values gradually increase from H=22 up to 28 GPa as x is increased from x=0 to x=0.43. The hardening mechanism is mainly attributed to strong electron structure modification due to the substitutional introduction of Al atoms. The thermal stability against oxidation and phase decomposition was investigated by heating the films in air and in ultra high vacuum (UHV). Zr1-xAlxN films with 0.27≤x≤0.43 show an excellent resistance against oxidation compared to pure ZrN. The oxide layers were found to grow according to a parabolic diffusion law with activation energies of 1.21, 2.56 and 2.54 eV for ZrN, Zr0.73Al0.27N and Zr0.57Al0.43N, respectively. In UHV, the Zr0.57Al0.43N film is stable during annealing at 923 K/60 min. Above this temperature, a spinodal decomposition is initiated leading to the formation of nano-sized regions of cubic-AlN and Zr rich cubic-Zr1-xAlxN as evidenced from the broadening of the X-ray diffraction peaks. A significant increases in hardness up to 33 GPa is observed after such a structural modification.
BP-38 Thermal Stability and Microstructure Characterization of CrN/WN Multilayer Coatings Fabricated by Ion-Beam Assisted Deposition
Y.-Z. Tsai, J.G. Duh (National Tsing Hua University, Taiwan)
CrN/WN multilayer coatings were deposited on the silicon (100) and stainless steel substrate by the ion-beam assisted deposition process. The bilayer periods were designed and controlled in the range between 3nm to 30nm. The CrN/WN films were annealed from 500°C to 900°C for 1hour in the nitrogen atmosphere to evaluate the thermal stability of these coatings. Microstructural evolution of the CrN/WN multilayer coatings in the as-deposited and heat-treated states was investigated by transmission electron microscopy (TEM). The phase transformation after annealing was probed by X-ray diffraction (XRD). The hardness of as-deposited CrN/WN coating with periods smaller than 10nm was much higher than that of CrN and WN single layers. The thermal stability of CrN/WN multilayer coatings with different bilayer periods was also discussed in correlation to the associated microstructural evolution.
BP-39 The Synthesis of Teflon Thin Film Deposited by RF Magnetron Sputtering System
K.S. Shin, H.Y. Lee, K.H. Nam, J.G. Han (Sungkyunkwan University, South Korea)
In case of conventional teflon films, because of its merits such as a superior hydrophobic, very low friction coefficient and electric insulation, it has been used in many industrial and technical application. At present, these films have been synthesized by chemical methods. However, polymeric films obtained using these methods have many problem controlling the film structure, thickness and adhesion. In recent years, plasma polymerization has become center of the attention for improvement of these problems. In this study, teflon (PTFE, polytetrafluoroethylene) thin film on Si wafer substrate was synthesized by rf magnetron sputtering system. The properties of thin film were estimated using FT-IR, XPS, contact angle measurement, and EIS. Preliminary results were confirmed that C-F absorption peak was increased according to the increase of working pressure. The detailed results will be presented.
BP-40 Sputtered Fe1-x (N1-yCy)x Films Obtained in Various (Ar-N2-CH4) Reactive Plasmas
I. Jouanny, A. Billard, Tran Huu Loi, V. Demange, E. Bauer-Grosse (École des Mines, France)
The Fe1-x(N1-yCy)x iron carbonitrides commonly encountered with high non-metal content are the ε (x=0.25-0.33) and ζ (x=0.33-0.36) phases whose structures derive from the ones existing in the binary Fe-N system by substituting N by C. As it is possible to synthesize cubic γ'' and γ''' iron nitrides with an atomic nitrogen content x close to 0.5, we study here the possibility to substitute N by C to obtain carbonitrides close to an equiatomic non-metal content. Fe1-x(N1-yCy)x films were deposited on copper substrates using a triode sputtering magnetron mode with an iron target in a variable reactive Ar-N2 and/or CH4 mixture. Electron Probe Micro Analysis and Energy Dispersive X-ray analysis were used to determine their composition. The as-sputtered states were identified by X-ray diffraction. The target being magnetic, we propose a particular geometry allowing sputtering. In a pure (Ar-N2) reactive plasma (y = 0), the atomic nitrogen content x in the films increases linearly from 0 to 0.51 with the N2 flowing rate and then stay constant. The successive nitrides, ε-Fe3N, ζ-Fe2N and a mixture of γ'' and γ''' can be identified. However, some diffraction peaks remain not indexed using the previous phases. In a pure (Ar-CH4) reactive plasma (y = 1), the atomic carbon content x in the films increases rapidly and linearly from 0.28 to 0.62 as a function of the CH4 flowing rate while structure changes from ε-Fe3C to χ-Fe5C2 and then to an amorphous compound. In a variable (Ar-N2-CH4) reactive plasma, Fe1-x(N1-yCy)x ternary films keeping x close to 0.5 with various y values within the range 0-0.46 are obtained. The crystalline carbonitrides detected by X-ray evolves from a γ''/γ''' mixture for y=0 to ζ for y=0.41-0.46 passing through a ζ/γ''' mixture for y=0.33.
BP-42 Determination of the Neutral Gas Temperature of Nitrogen Containing Low Pressure Plasmas using a Two-Temperature Model
V. Linss (ASMEC GmbH, Germany); H. Kupfer, S. Peter, F. Richter (TU Chemnitz, Germany)

The neutral gas temperature is an important process parameter in low pressure plasmas. On the one hand, chemical reactions may be thermally driven. On the other hand the contact of the process gas with the substrate cannot be avoided so that in particular for thermally sensitive substrates the knowledge of the gas temperature is essential.

The neutral gas temperature is often determined by evaluating the shape of rotational spectra of diatomic molecules present in the plasma. In low pressure plasmas the light emission takes place before the thermalisation of the rotational level population of the electronically excited state. Thus, the observed population of the rotational levels is determined by the excitation mechanisms and the rotational level population of the electronic states which the upper electronic state of the chosen molecule band is populated from.

We used the first negative system of the nitrogen molecule ion for temperature determination in different kinds of low pressure discharges. The spectra were evaluated by fitting. We will show that the spectra can be fitted best assuming that they are composed of two contributions representing two populations of the nitrogen molecule ion with distinct different rotational temperatures. Thus, at least two excitation channels of the upper electronic state have to be considered. One excitation channel is the electron impact on the ground state of the neutral nitrogen molecule connected with ionisation and excitation. In this process the rotational level distribution remains essentially unchanged and the rotational temperature of the so generated molecule ions reflects the gas temperature. The second excitation channel is the impact of nitrogen molecules in high vibrational states on the ground state nitrogen molecule ion. This is connected with rotational excitation and thus the rotational temperature of the so generated excited molecule ions is much higher than the gas temperature.

BP-43 The Challenge of Nano-Wire for Advanced Interconnects
H.-W. Chen, H.-C. Chen, Y.-L. Cheng, J.-H. Lin, C.-T. Lin (Taiwan Semiconductor Manufacturing Company, Ltd., Taiwan); S.-P. Jeng (Taiwan Semiconductor Manufacturing Company, Ltd., Taiwna); C.-M. Wu (Taiwan Semiconductor Manufacturing Company, Ltd., Taiwan)
In this study, the feasibility of fabrication of copper nano-wire for advanced interconnects is demonstrated. Various copper wires with a minimum geometry of 90nm by 180nm were obtained for the characterization of resistivity with cross-section area with the temperature range from 0°C to 180°C. For the smallest line, the resistivity is 2.65 times higher than the copper bulk value (1.76 µΩ-cm). The proposed model, based on electron surface and grain boundary electron scattering, can explain the resistivity increase. In addition, a 2-D effect is taken into account, because the size dependent resistivity not only depends on the line-width but also on the thickness. Within the framework of Matthiessen's rule, a universal formula, which combines temperature and size effects, is proposed. Based on this model, a forecast down to the 22 nm generation was conducted, the variation of Rs for various line width will be an important issue. It suggests some new design rule and layout scheme is needed.
BP-44 Structural and Mechanical Properties of Nanocomposite TiAlCrN Coatings Synthesized by a Cathodic-Arc Deposition Process
Y.-Y. Chang, D.-Y. Wang, C.-Y. Hung (Mingdao University, Taiwan)
TiAlN, CrN and TiAlCrN nanocomposite coatings were synthesized by cathodic-arc evaporation with plasma enhanced duct equipment. Chromium and Ti50Al50 alloy cathodes were used for the deposition of nanocomposite TiAlCrN coatings. The effects of bilayer thickness and chromium content on the microstructure and mechanical properties of nanocomposite TiAlCrN coatings were studied. The nanolayer thickness of the deposited coating was correlated with rotation of the substrate holder. In this study, field emission scanning electron microscope and X-ray diffraction using Bragg-Brentano and glancing angle parallel beam geometries were used to characterize the microstructure and stress of the deposited films. The composition and chemical bonding of deposited TiAlN, CrN and TiAlCrN coatings were evaluated by X-ray photoelectron spectroscopy and glow discharge optical emission spectroscopy. Hardness, Young's modulus and adhesion strength of the coatings were determined by nano-indentation and Rockwell indentation methods. It has been found that the structural and mechanical properties of the films were correlated with the addition of chromium and nanolayer thickness.
BP-45 Size Effects in Strengthening Mechanisms of AlN/TiN Multilayer Thin Films
A. Karimi, Th. Vasco, R. Sanjines (EPFL, Switzerland)
Nanometer scale multilayer materials exhibit a variety of interesting structural and mechanical properties, for example greater toughness and higher hardness as compared to the rule of mixture. For the purpose of understanding the fundamental aspects of phase stability and for exploring strengthening mechanisms in such composite structures, the AlN/TiN system was chosen for investigation. TiN crystallises in fcc-NaCl, while the equilibrium structure of AlN at atmospheric pressure is hexagonal wurtzite. Thus the formation of non-isostructural multilayers is expected. Decreasing the bilayer thickness to nm scale range favors the stabilisation of fcc-AlN due to pseudomorphic effects and thereby to the formation of isostructural layers and development of coherency stresses. In addition, AlN and TiN are immiscible at low temperatures such that sharp and stable interfaces are expected promoting large hardness enhancement at low temperature deposition. At higher deposition temperatures, however, substantial chemical reactions could occur leading to the formation of ternary alloy phases. These structural features play a major role on overall mechanical properties and fracture behaviour of multilayer thin films. By controlling the thickness of individual layers (2-50 nm) and substrate temperatures (Room, 400°C, 800°C) a number of controlled microstructures were grown in a reactive magnetron sputtering. The films were characterized using grazing incidence XRD, nanoindentation, and cross sectional TEM. Indentation induced crack modes and morphologies were also investigated using AFM together with some FIB cross section of indents. In this paper, the results will be discussed in terms of characteristic features of magnetron sputtering deposition conditions together with different strengthening mechanisms operating in solid solutions and nanolayer materials relevant to AlN/TiN system.
BP-47 Microstructure and Mechanical and Tribological Properties of Novel Multi-Component Nanolayered Nitride Coatings
Q. Yang, L.R. Zhao (National Research Council, Canada)
Novel multi-component nanolayered nitride coatings composed of alternating four layer constituents in a modulation period (Λ), i.e. TiN, Mo2N, ZrN and AlN, were synthesized using the unbalanced closed-field magnetron sputtering technique. The microstructural evolution and mechanical properties of the coatings were investigated over a wide range of the modulation period. X-ray diffraction studies indicated that at the smallest Λ of 1.8 nm, all the layer constituents formed a single cubic B1 structure, with a lattice constant near the average of the individual constituents. In addition, a moderate (200) preferred orientation was observed in this condition. With increasing the modulation period, the preferred orientation diminished and the cubic structure evolved to form hexagonal AlN layers, followed by the formation of crystallographic equilibrium structures of the individual constituents at Λ larger than 20 nm. These microstructural changes had a direct influence on the hardness and Young's modulus of the coatings. The maximum hardness of 34 GPa was obtained at Λ=31.1 nm, which was considerably higher than the rule-of-mixture hardness of the constituent layers. The coatings exhibited lower Young's modulus and significantly higher H3/E2 ratios than monolayered TiN coating. Dry sliding tests demonstrated that these coatings had a lower friction coefficient and higher dry sliding wear resistance than TiN coating.
BP-48 Improvement in Corrosion and Nickel Release Behavior of Plasma-Treated Porous NiTi Shape Memory Alloys
S.L. Wu, C.Y. Chung, J.P.Y. Ho, P.K. Chu (City University of Hong Kong)
Porous NiTi shape memory alloy is one of the most promising biomaterials in human surgical implants. However, possible nickel release and susceptible corrosion properties of porous NiTi may cause harm in the human body. In this work, plasma immersion ion implantation (PIII) was used to enhance the corrosion resistance and reduce the nickel release of porous NiTi prepared by capsule-free hot isostatic pressing (CF-HIP). The corrosion characteristics and nickel out-diffusion behavior of the porous NiTi before and after PIII were studied at 310K by potentiodynamic polarization tests and immersion tests in simulated body fluids (SBF). The porous NiTi samples before and after immersion in SBF were investigated using x-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Our results show that the corrosion resistance of the porous NiTi samples after undergoing PIII is significantly improved as demonstrated by the decrease of icorr. The amount of nickel leached from the treated porous NiTi is also found to be much less than that of the sample without PIII. XPS results indicate that a nickel-depleted surface layer is produced by PIII and acts as a barrier for out-diffusion.
BP-49 Characteristics of Interface between Ta2O5 Thin Film and Si (100) Substrate
A.P. Huang, P.K. Chu (City University of Hong Kong)
As the feature size of ultra large scale integration (ULSI) devices shrinks, thinner gate oxides are necessary to achieve the MOSFETs with high performance. The conventional SiO2 gate dielectric has almost reached its limits due to the high direct tunneling current. Recently, gate dielectric materials such as tantalum pentoxide (Ta2O5) have attracted great interest. Control of the interface between the Ta2O5 gate dielectric and Si substrate is considered to be one of the most challenging issues for good device performance. In our previous work, crystallization control of Ta2O5 thin films deposited on n-type Si (100) was achieved at lower substrate temperature by introducing substrate biasing, and even at a low substrate temperature of 400°C, partially crystallized Ta2O5 thin films were also obtained [1]. In this work, the influence of the substrate bias on the interfacial characteristics of Ta2O5 thin films on Si are investigated in details. Our results show that by applying a bias to the Si substrates, the crystallinity of Ta2O5 thin films can be improved, although the thickness of the interfacial layer between Ta2O5 and Si (100) remains about the same. The amount of Ta in this interfacial region is also quite uniformly distributed. Under negative biasing conditions, diffusion of Ta ions into the substrate is accelerated, whereas that of oxygen is restrained. Therefore, the Ta to O ratio in the film increases even though the Ta and O contents decrease in the interfacial layer. Our results suggest that proper control of the formation of the interfacial layer is very important. The effects and mechanism of biasing on the interfacial layer is also described in this paper.
BP-52 Time Evolutions of Electron Energy Distribution Function and Plasma Parameters in Pulsed Magnetron Discharges
S.-H. Seo, J.-H. In, H.-Y. Chang (KAIST, South Korea); J.G. Han (Sungkyunkwan University, South Korea)

Using a time-resolved Langmuir probe 2, the temporal evolution of electron energy distribution function and plasma parameters is investigated under various frequencies from 5 kHz to 50 kHz and various duty cycles from 10 to 90% at 20 kHz in unipolar pulsed dc magnetron discharge. With the substrate grounded, the measured electron distributions show a bi-Maxwellian distribution with high-energy electron tail during the pulse-on irrespective of the driving frequency. In the after glow after the pulse-off, the decay rates of the electron temperature and the electron density are characterized by the two characteristic decay times of the fast decay of order of few μmsec and the slower decay of order of few tens μmsec. On the other hand, the existence of the high-energy primary electrons of which energy reaches to a third of the cathode voltage is observable during few μmsec after the pulse-on. These phenomena will be explained by considering the electron transport under the magnetic field.

In the constant-voltage mode at 20 kHz, the averaged electron temperature in the pulse-on period increases as the duty cycle is reduced, 4.1 eV at 10% and 2.7 eV at 90 %. However, the averaged electron temperature weakly depends on the driving frequency in the present frequency range. From the detailed measurements of the electron energy distribution functions, the increased electron temperature is caused by the decrease of low-energy electrons and the increase of energetic electrons with decreasing the duty ratio.

1 The authors would like to thank the Engineering and Research Center (grant no. R11-2000-086-03007-0) for their financial support of this research.

2 The company Plasmart Ltd. is specially acknowledged for the technical support and the supply of probe acquisition system.

BP-53 On the Spinodal Nature of the Phase Segregation and Formation of Stable Nanostructure in the Ti-Si-N System
R.F. Zhang (Tsinghua University, China); S. Veprek (Technical University Munich, Germany)

The formation of superhad nanocomposites nc-TiN/a-Si3N4 with a high thermal stability and oxidation resistance was explained by strong, thermodynamically driven phase segregation1. Later on, it was suggested that this segregation is of spinodal nature and, therefore, results in the formation of a stable nanostructure by self-organization (e.g.2), but this has been questioned by several researchers. In this paper we present thermodynamic calculations which clearly show that the second derivative of the free energy of the formation of the mixed TixSi1-xN phase with the composition x is negative, i. e. it meets the condition of the spinodal nature of the phase segregation within the whole range of nitrogen pressure that was used during the deposition of these nanocomposites by Veprek et al. For the calculation, we proposed an empirical thermodynamic model based on the sublattice model3 and then the model was used for interpretation of the phase segregation in the ternary Ti-Si-N systems. The results show that the phase segregation in the ternary Ti-Si-N systems is of typical spinodal nature at the nitrogen pressure typically used during the deposition of these coatings (i.e. about 1mbar for plasma CVD and 0.002 mbar for reactive sputtering) and deposition temperature of 550°C (823 K). Only at much lower nitrogen pressure and much higher temperature, the spinodal decomposition can not occur. The important role of the nitrogen activity during the deposition will be illustrated by several examples. The theoretical calculations are supported by experimental results available so far.

1S.Veprek and S.Reiprich, Thin Solid Films 268(1995)64

2 S.Veprek and A.S.Argon, J. Vac. Sci. Technol. B 20(2002)650

3 M Hillert, Phase equilibria, Phase phase Transformations: Their Thermodynamic Basis, Cambridge University Press, United Kingdom, 1998

BP-54 Silicon Nitride Films by Chemical Vapor Deposition in Fluidized Bed Reactors at Atmospheric Pressure (AP/FBR-CVD)
J. Perez-Mariano, S. Borros (Institut Quimic de Sarria, Spain); J.A. Picas, A. Forn (Universitat Politecnica de Catalunya, Spain); C. Colominas (Institut Quimic de Sarria, Spain)

Silicon nitride thin films can be deposited by several chemical and physical methods. In this work we study the Chemical Vapor Deposition in Fluidized Bed Reactors at Atmospheric Pressure (AP/FBR-CVD) for the deposition of silicon nitride coatings on AISI316 steel. The unique thermal and transport properties of the fluidized bed minimize some of the limitations of conventional CVD methods, such as inhomogeneities that lead to variations in thickness, and sometimes difficulty in mantaining the substrate at uniform temperature. Additionally, the particles of the bed can be activated through alternating reaction steps to promote the formation in situ of highly reactive silicon-containing species and thus increase the deposition rate. It is suggested that these thin and very homogeneous FBR-CVD ceramic films could be used as a part of a multilayer strategy to build more sofisticated coatings.

The coatings were obtained by the reaction of silicon tetrachloride and ammonia in a reducing atmosphere at temperatures in the range 700 °C to 800 °C. The composition and structure of the coating were determined by means of X ray Diffraction (XRD), Scanning Electronic Microscopy (SEM), Energy Dispersive X-ray analysis (EDX), Infrared Spectroscopy (FT-IR), Glow Discharge Optical Emission Spectroscopy (GD-OES) and X-ray Photoelectronic Spectroscopy (XPS). Silicon nitride films were amorphous and substoichiometric. We found that the deposition temperature has a great influence in their morphology and mechanical properties. An underlayer containing chromium nitride was found at the coating-steel interface.

BP-55 Formation Behavior of Nano-Structured CrAlN Coatings by Cathodic Arc Plasma Deposition
S.S. Kim (Institute for Advanced Engineering, South Korea); J.G. Han (Sungkyunkwan University, South Korea)
CrN coatings are successfully being applied for various metal forming molds and dies, for plastic manufacturing as well as for machinery parts. However, with a reported oxidation threshold temperature of 700°C, CrN coatings may be limited for oxidation resistant application at elevated temperature. For this reason, higher oxidation resistance than that of CrN coatings is required. It is well known that the TiAlN coatings have higher oxidation resistance because of the Al2O3 layer formation on the film surface at elevated temperature. In this study the Cr-Al-N films were deposited on the hot working tool steels (AISI H13steel) by cathodic arc plasma deposition (CAPD) process. The films were deposited at various substrate bias voltages of 0-400V and different target current ratio of chromium and aluminum. Relative chemical compositions of the deposited Cr-Al-N films were evaluated by EDX as well as AES. The as deposited microstructure and morphology were studied by XRD and SEM respectively, and micro-knoop hardness tester was employed to measure a hardness of the CrAlN films. Preliminary results indicated that the structural characterization of the Cr-Al-N films were strongly depended upon target current ratio of the chromium and aluminum as well as substrate bias voltages. Moreover, we found that the microhardness of the Cr-Al-N films were higher than that of the CrN film. Detail result on experiments such as oxidation property on progress will be presented.
BP-56 Development of Thick, Hard Coatings for Erosion Protection Applications
R. Wei, C. Rincon, E. Langa, J. Arps (Southwest Research Institute)
Next generations of turbine engine compressor blades, vanes and rotor blades in advanced aircraft and fluid pump impellers require very thick and very hard ceramic coatings. In addition the piston rings for heavy-duty diesel engines also require thick wear resistant coatings. To meet these challenges, a plasma-enhanced magnetron sputtering (PEMS) technology is being developed at SwRI to deposit thick and hard coatings (>30 µm). The technique combines conventional magnetron sputtering technique with externally generated plasma from which high current density can be obtained. By using heavy ion bombardment prior to and during deposition to increase the coating adhesion and modulate the film stress, thick TiN, CrN, and TiCrN coatings over 50 µm have been obtained. In addition to conventional hard coatings, thick nanocomposite coatings TiN/Si3N4 and multi-layer nanocomposite coatings have also been studied. In this paper, we will discuss the deposition technology, the effect of ion bombardment on the coating microstructure, the nanohardness measurement and the erosion test results.
BP-57 Nitriding of Low Alloy Steel by Electron Beam Excited Nitrogen Plasma
P. Abraha, K. Kamiya (Meijo University, Japan)
We have achieved nitriding of Cr-Mo alloyed steel samples using a low-power electron-beam-excited plasma in nitrogen atmosphere. The system consists of the discharge plasma region, the acceleration region, and the plasma region. Argon gas is introduced to the discharge region, and dc discharge is developed between the cathode, lanthanum hexaboride, and the subsequent electrode. The cathode is heated by a tungsten filament so as to emit electrons and allow the discharge region to be the source of the electrons for the EBEP system. Upon applying a voltage Va to the accelerting electrode, the electrons are accelerated to the plasma region with an energy that corresponds to Va. The electron beam collides with the process gases introduced through the mass flow controllers to generate plasma. paragraphThe samples are plates of Cr-Mo alloyed steel that is typically used as structural material. The plates were set in the direction of the electron beam at a distance of 10 cm from the accelerating electrodes and kept at a floating potential. Upon irradiation by the electron beam, the plates are charged up to the minus voltage of the beam energy and the temperature is easily elevated up to around 500 degrees centigrade. paragraphTypical x-ray diffraction (XRD) patterns obtained from the nitrided samples processed at an accelerating voltage Va of 140V, corresponding to the electron beam energy of about 140 eV, show peak signals of nitride compounds. When the time duration of the nitriding was set to 3 hours, the hardness of the nitrided sample was measured to be 920 Hv, more than twice the untreated sample hardness of 400Hv. We have also tried nitriding of narrow gap features and obtained reasonable success.
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