AVS 72 Wednesday Morning
Sessions | Time Periods | Topics | Schedule Overview
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Click a Session in the first column to view session papers.
| Session | Wednesday, November 11, 2026 | ||||||||||||||||||
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| 8:00 AM | 9:00 AM | 10:00 AM | 11:00 AM | 12:00 PM | |||||||||||||||
| 2D-WeM |
Functionalizing 2D Materials with Defects and Dopants Using Ultra-Low Energy Ions
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Clean Integration of h-BN Encapsulated Graphene Heterostructures with Ferroelectric Al1-xBxN Thin Films for Robust Carrier Concentration Modulation
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Hidden in Plain Sight: Aromaticity of Hexagonal Boron Nitride
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Damage-Free Fabrication of Single Photon Emitters in Hexagonal Boron Nitride by Remote Plasma Generation of Vacancies
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Probing Static and Dynamical Phenomena in Magnetic Systems Using Spin Defects in Hexagonal Boron Nitride
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Characterization of Optically Active Spin Defects in hBN as Quantum Sensors
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Towards Probing spin dynamics in mesoscopic sized 2D magnets
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BREAK - Complimentary Coffee in Exhibit Hall
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A New Topological Monolayer
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Spatially-resolved Voltage-reversal due to Bernoulli Potentials in Dissipative Bi2Sr2CaCu2O8+x
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Signature of Ferromagnetic and Ferroelectric Coupling in WTe2/Cr2Ge2Te6 Heterostructures
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Electrical Detection of NéEl Vector Reversal in a Van Der Waals Antiferromagnet
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| AP+ |
Cyclic dielectric etching challenges for next-generation FDSOI logic and quantum devices
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Atomic Layer Etching of TiN using O2/Ar Plasma and SF6/H2/Ar Plasma Half-Cycles
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Atomic Layer Etch Process for InGaAs Using (CH4+H2)/Ar+ Plasma
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O2/CF4/Ar+ 3-Step Plasma Atomic Layer Etch Process for Aluminum
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Directional Atomic Layer Etching of Lithium Niobate for Nonlinear Integrated Nanophotonics
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Native Oxide Removal and Passivation of Niobium for Superconducting Devices
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Thermal Atomic Layer Etching of the Semiconductor Oxide Channel Materials by Sequential Surface Modification and Volatile Release Reactions
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BREAK - Complimentary Coffee in Exhibit Hall
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Isotropic Atomic Layer Etching via Thermal-Cyclic Processing: Broad Material Capabilities with a Focus on Work–Function Metal Films
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Selective Thermal Chemical Vapor Etching (CVE) and Atomic Layer Etching (ALE) of Ge Versus Si
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Controlled SiO2 Etch Rates Using a HF/H2O Liquid-Layer in a Vacuum Environment: Dependence on H2O and HF Pressures
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Thermal Selective Etching of Si1-xGex in XeF2
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| AS-WeM |
Non-destructive XPS Depth Profiling Using a Three-Anode HAXPES Source with Simultaneous (Angle-Resolved) Data Collection over a Range of Angles
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XPS Depth Profiling of Multilayer Stacks using Femtosecond Laser Ablation (fs-LA)
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Calibration of Removal Rates for fs-Laser Ablation XPS Depth Profiling
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IR Femtosecond-Laser Ablation of IR-Transparent Coatings - Consequences for XPS Depth Profiling
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AFM Analysis of Surface Morphology and Grain Growth in Ag Thin Films Prepared by RF Magnetron Sputtering
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Non-Destructive Depth Profiling with a Multi-Colored Monochromated X-Ray Source
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Evaluating Oxygen Gas Cluster Ion Beams for Inorganic Depth Profiling in Tof–Sims
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Low-k SiOC Etching: Correlating Surface Reaction Mechanisms with SiOC/poly-Si Etching Selectivity
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BREAK - Complimentary Coffee in Exhibit Hall
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Multimodal Surface Analysis and Depth Profiling Using Femtosecond Laser Ablation, Ion Sputtering, and Ion Scattering Spectroscopy
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Velocity-Resolved Snms as a Surface-Analytical Probe of Electronically Driven Sputtering Under Swift-Heavy-Ion Irradiation
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Experimental Validation of Monte Carlo Transport Simulations for MoS2 Sputter Deposition
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TOF-SIMS Depth Profiling of Inorganic–Organic Multilayers Using a Hybrid Sputtering Approach
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Resolving Chemical Speciation in Complex Nickel-Based Electrocatalysts through Detailed XPS Analysis and Corroborations with ToF-SIMS
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| EM-WeM |
Rigorous Electrostatic Constraints for Interface State Extraction in Wide-Bandgap MOS Devices
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Doping Dependent Defect Formation in Heavy Ion Irradiated β-Ga2O3
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Influence of Substrate Orientation and Surface Treatments on n-Ga2O3/p-GaN Heterointerface Quality
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A Comparison of Cr/Au and Ti/Au Ohmic Contacts on β-Ga2O3
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Temperature-Driven Reversible Carrier-Polarity Switching in Bi-Doped SnSe
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Hybrid MBE for Freestanding Ultra-wide Bandgap CaSnO3 Thin Films Using a Water-soluble BaO Sacrificial Layer
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BREAK - Complimentary Coffee in Exhibit Hall
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Suppression of Stacking Fault Expansion in SiC Epitaxial Layers via Substrate Implantation
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Processing of SiC Pillar Arrays for Quantum and Photonic Applications
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Structural and Electrical Characterization of He Ion Implanted 4H-SiC
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Impact of ZnO Deposition Method on Post-Illumination Charge Trapping and Recovery in Organic Photodiodes
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Accelerated Data-Efficient Metasurface Simulation Using Deep Learning and Neural-Adjoint Inverse Design
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| FUS-WeM |
Water Detritiation: From ML-Guided Selection to Catalyst Synthesis
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Al Intercalation Into C-Vacancy Sites in TiCx for Low-Temperature Synthesis of MAX-Phase Ti2AlC Hydrogen Permeation Barrier Coatings
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Characterizing Heavy Water Displacement in Molecular Sieve Drying Beds for Practical Trace Tritium Capture Methods
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Characterizing the Behavior of Hydrogen Isotopes and Impurity Species on Vanadium Surfaces by Direct Recoil Spectroscopy
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Theoretical and Experimental Study of Hydrogen Super-Permeation in Iron
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Development of Tungsten Alloys to Mitigate Impacts of Neutron Irradition on Tritium Inventory
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BREAK - Complimentary Coffee in Exhibit Hall
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Liquid Metals as Plasma-Facing Components in Fusion Devices: Can They Solve the Power Handling Challenge?
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Atomic Layer Deposition Affecting Gas Retention in Fusion Targets
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Measurement of Residual Impurities after a Cryogenic DT Inertial Confinement Fusion (ICF) Implosion
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FORGED-PFC High Heat Flux Facility Vacuum Vessel Design Status
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Materials and Deposition Technologies Underlying Target Fabrication for Inertial Confinement Fusion
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| PS1-WeM |
Challenges in Plasma Etching for 3D Interconnect Technology
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Low Global Warming Potential (GWP) Gases for Deep Si Etch for Through-Silicon Via (TSV) Applications
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Multiscale Modeling Approach for Bosch Silicon Etching Process Coupled to Machine Learning, Toward a Fast Etching Process Optimization
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Feature-Scale Model of Si Plasma Etching in SF6/O2/SiF4 Mixtures
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Transport Gradient Model of Oxygen and Fluorine Flux Ratio in High-Aspect-Ratio Silicon Etching
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Effects of Discharge Frequency and Precursor Molecule on the Deposition Rate, Film Density, and Residual Stress of a-C:H Hard Masks
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Impact of HBr/H2 Gas Mixture on Etching of GeSexTe1-x Chalcogenide Thin Films for Reconfigurable and Nonlinear Photonics
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BREAK - Complimentary Coffee in Exhibit Hall
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| PS2-WeM |
Etch Opportunities in Advanced Packaging, Silicon, and Optical Photonics
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Impact of Surface Activation Plasma Chemistry on AlN - Oxide Wafer Bonding for BSPDN Applications
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Optimization of Dielectric Plasma Activation for Wafer to Wafer Fusion Bonding
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Plasma-Induced Surface Modification of Indium for Improved Bonding
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| SS-WeM |
Molecular Systems for Reversible Hydrogen Storage: Atomistic-Level Insights
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When Interfaces Break Scaling: Metal–Ceria Catalysts for Selective Methane Conversion
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Supported Ni-Cu Catalysts for the Selective Dehydrogenation of Liquid Organic Hydrogen Carriers
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Surface Structure, Stability, and Catalytic Reactivity of Metal Nanoparticles Supported on Tantalum Oxide
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CO Oxidation on Plasma-Activated Pd and PdAg Surfaces
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Catalysis with Liquid Gallium Alloys
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BREAK - Complimentary Coffee in Exhibit Hall
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Ni as a Promotor for Ethylene Epoxidation: Computation, Surface Science, and Reactor Studies
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Tuning Oxygen Activation on Gold with RhAu Single-Atom Alloys
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Reaction Product and Single-Atom Promotion of Acetylene Cyclotrimerization and Cross-Coupling on Ag(111)
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Selective Hydrogenation of Styrene to Ethylbenzene Over a Pd/Cu(111) Single Atom Alloy Surface
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| TF1-WeM |
Thin-film and Redox-active Polyvinyl Metallocene via Chemical Vapor Deposition
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Amine Functionalization of Polydioxanone at Low Temperature By oMLD of Poly(p-phenylenediamine)
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oCVD Enabled Conjugated Polymer Alloying for Filler-Free High-Capacity Chloride Storage Cathodes
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Rational Design of Fluoroalkyl-Free Liquid-Repellent Coatings Accessed via Photoinitiated Chemical Vapor Deposition (piCVD)
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Designing Functional Polymer Thin Films via Initiated Chemical Vapor Deposition
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Kinetically Defined Radical Queching Window for Area-Selective Photoinitiated Chemical Vapor Deposition (AS-PiCVD)
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Development of Vapor-Imprinted Polymers for Food Spoilage Monitoring via Selective Acetoin Detection
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BREAK - Complimentary Coffee in Exhibit Hall
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| TF2-WeM |
Molecular Layer Deposition of Polyurea Film and their Role in Sidewall Passivation during Reactive Ion Etching in HF Plasmas
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Realizing Controlled Porosity in Atomic Layer Deposited Metal Oxides
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Coordination-Driven Ambient Infiltration of Silicon and Germanium Precursors for the Synthesis of Polymer–Inorganic Hybrid Materials
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Negative-Tone PMMA-InOx Hybrid Resist Prepared by Sequential Infiltration Synthesis
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| TS-WeM |
Utilizing the SI Redefinition and “NIST on a Chip” to Ensure Readiness Across the United States Air Force, Army, and Navy
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Air Force Temperature Metrology and Photonic Thermometer Applications
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The Standard Photonic Thermometer (SPoT) program at NIST
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From SPRT Comparison to SI-traceable Photonic Thermometry with SPoT
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Optical Frequency Comb Metrology for Assessing the Ultimate Stability of SPoT in a Water Triple-point (WTP) Cell
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Dual Mode-Locked Comb Readout Method for Chip-Scale Silicon Photonic Thermometer
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Developing Portable Tools for Photonic Thermometry
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BREAK - Complimentary Coffee in Exhibit Hall
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A Lighter Footprint: The Evolution of Ring-Resonator Thermometer Design at NRC
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Chip-Based Photonic Thermometers: In-Situ Calibration and Si Traceability
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Band-Edge Optical Microthermometers for Ultrahigh-Resolution Temperature Sensing
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Quantitative Temperature Mapping with Nanometric Resolution
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