AVS 72 Wednesday Morning

Sessions | Time Periods | Topics | Schedule Overview

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Session Wednesday, November 11, 2026
8:00 AM 9:00 AM 10:00 AM 11:00 AM 12:00 PM
2D-WeM
Functionalizing 2D Materials with Defects and Dopants Using Ultra-Low Energy Ions
Clean Integration of h-BN Encapsulated Graphene Heterostructures with Ferroelectric Al1-xBxN Thin Films for Robust Carrier Concentration Modulation
Hidden in Plain Sight: Aromaticity of Hexagonal Boron Nitride
Damage-Free Fabrication of Single Photon Emitters in Hexagonal Boron Nitride by Remote Plasma Generation of Vacancies
Probing Static and Dynamical Phenomena in Magnetic Systems Using Spin Defects in Hexagonal Boron Nitride
Characterization of Optically Active Spin Defects in hBN as Quantum Sensors
Towards Probing spin dynamics in mesoscopic sized 2D magnets
BREAK - Complimentary Coffee in Exhibit Hall
A New Topological Monolayer
Spatially-resolved Voltage-reversal due to Bernoulli Potentials in Dissipative Bi2Sr2CaCu2O8+x
Signature of Ferromagnetic and Ferroelectric Coupling in WTe2/Cr2Ge2Te6 Heterostructures
Electrical Detection of NéEl Vector Reversal in a Van Der Waals Antiferromagnet
AP+
Cyclic dielectric etching challenges for next-generation FDSOI logic and quantum devices
Atomic Layer Etching of TiN using O2/Ar Plasma and SF6/H2/Ar Plasma Half-Cycles
Atomic Layer Etch Process for InGaAs Using (CH4+H2)/Ar+ Plasma
O2/CF4/Ar+ 3-Step Plasma Atomic Layer Etch Process for Aluminum
Directional Atomic Layer Etching of Lithium Niobate for Nonlinear Integrated Nanophotonics
Native Oxide Removal and Passivation of Niobium for Superconducting Devices
Thermal Atomic Layer Etching of the Semiconductor Oxide Channel Materials by Sequential Surface Modification and Volatile Release Reactions
BREAK - Complimentary Coffee in Exhibit Hall
Isotropic Atomic Layer Etching via Thermal-Cyclic Processing: Broad Material Capabilities with a Focus on Work–Function Metal Films
Selective Thermal Chemical Vapor Etching (CVE) and Atomic Layer Etching (ALE) of Ge Versus Si
Controlled SiO2 Etch Rates Using a HF/H2O Liquid-Layer in a Vacuum Environment: Dependence on H2O and HF Pressures
Thermal Selective Etching of Si1-xGex in XeF2
AS-WeM
Non-destructive XPS Depth Profiling Using a Three-Anode HAXPES Source with Simultaneous (Angle-Resolved) Data Collection over a Range of Angles
XPS Depth Profiling of Multilayer Stacks using Femtosecond Laser Ablation (fs-LA)
Calibration of Removal Rates for fs-Laser Ablation XPS Depth Profiling
IR Femtosecond-Laser Ablation of IR-Transparent Coatings - Consequences for XPS Depth Profiling
AFM Analysis of Surface Morphology and Grain Growth in Ag Thin Films Prepared by RF Magnetron Sputtering
Non-Destructive Depth Profiling with a Multi-Colored Monochromated X-Ray Source
Evaluating Oxygen Gas Cluster Ion Beams for Inorganic Depth Profiling in Tof–Sims
Low-k SiOC Etching: Correlating Surface Reaction Mechanisms with SiOC/poly-Si Etching Selectivity
BREAK - Complimentary Coffee in Exhibit Hall
Multimodal Surface Analysis and Depth Profiling Using Femtosecond Laser Ablation, Ion Sputtering, and Ion Scattering Spectroscopy
Velocity-Resolved Snms as a Surface-Analytical Probe of Electronically Driven Sputtering Under Swift-Heavy-Ion Irradiation
Experimental Validation of Monte Carlo Transport Simulations for MoS2​ Sputter Deposition
TOF-SIMS Depth Profiling of Inorganic–Organic Multilayers Using a Hybrid Sputtering Approach
Resolving Chemical Speciation in Complex Nickel-Based Electrocatalysts through Detailed XPS Analysis and Corroborations with ToF-SIMS
EM-WeM
Rigorous Electrostatic Constraints for Interface State Extraction in Wide-Bandgap MOS Devices
Doping Dependent Defect Formation in Heavy Ion Irradiated β-Ga2O3
Influence of Substrate Orientation and Surface Treatments on n-Ga2O3/p-GaN Heterointerface Quality
A Comparison of Cr/Au and Ti/Au Ohmic Contacts on β-Ga2O3
Temperature-Driven Reversible Carrier-Polarity Switching in Bi-Doped SnSe
Hybrid MBE for Freestanding Ultra-wide Bandgap CaSnO3 Thin Films Using a Water-soluble BaO Sacrificial Layer
BREAK - Complimentary Coffee in Exhibit Hall
Suppression of Stacking Fault Expansion in SiC Epitaxial Layers via Substrate Implantation
Processing of SiC Pillar Arrays for Quantum and Photonic Applications
Structural and Electrical Characterization of He Ion Implanted 4H-SiC
Impact of ZnO Deposition Method on Post-Illumination Charge Trapping and Recovery in Organic Photodiodes
Accelerated Data-Efficient Metasurface Simulation Using Deep Learning and Neural-Adjoint Inverse Design
FUS-WeM
Water Detritiation: From ML-Guided Selection to Catalyst Synthesis
Al Intercalation Into C-Vacancy Sites in TiCx for Low-Temperature Synthesis of MAX-Phase Ti2AlC Hydrogen Permeation Barrier Coatings
Characterizing Heavy Water Displacement in Molecular Sieve Drying Beds for Practical Trace Tritium Capture Methods
Characterizing the Behavior of Hydrogen Isotopes and Impurity Species on Vanadium Surfaces by Direct Recoil Spectroscopy
Theoretical and Experimental Study of Hydrogen Super-Permeation in Iron
Development of Tungsten Alloys to Mitigate Impacts of Neutron Irradition on Tritium Inventory
BREAK - Complimentary Coffee in Exhibit Hall
Liquid Metals as Plasma-Facing Components in Fusion Devices: Can They Solve the Power Handling Challenge? 
Atomic Layer Deposition Affecting Gas Retention in Fusion Targets
Measurement of Residual Impurities after a Cryogenic DT Inertial Confinement Fusion (ICF) Implosion
FORGED-PFC High Heat Flux Facility Vacuum Vessel Design Status
Materials and Deposition Technologies Underlying Target Fabrication for Inertial Confinement Fusion
PS1-WeM
Challenges in Plasma Etching for 3D Interconnect Technology
Low Global Warming Potential (GWP) Gases for Deep Si Etch for Through-Silicon Via (TSV) Applications
Multiscale Modeling Approach for Bosch Silicon Etching Process Coupled to Machine Learning, Toward a Fast Etching Process Optimization
Feature-Scale Model of Si Plasma Etching in SF6/O2/SiF4 Mixtures
Transport Gradient Model of Oxygen and Fluorine Flux Ratio in High-Aspect-Ratio Silicon Etching
Effects of Discharge Frequency and Precursor Molecule on the Deposition Rate, Film Density, and Residual Stress of a-C:H Hard Masks
Impact of HBr/H2 Gas Mixture on Etching of GeSexTe1-x Chalcogenide Thin Films for Reconfigurable and Nonlinear Photonics
BREAK - Complimentary Coffee in Exhibit Hall
PS2-WeM
Etch Opportunities in Advanced Packaging, Silicon, and Optical Photonics
Impact of Surface Activation Plasma Chemistry on AlN - Oxide Wafer Bonding for BSPDN Applications
Optimization of Dielectric Plasma Activation for Wafer to Wafer Fusion Bonding
Plasma-Induced Surface Modification of Indium for Improved Bonding
SS-WeM
Molecular Systems for Reversible Hydrogen Storage: Atomistic-Level Insights
When Interfaces Break Scaling: Metal–Ceria Catalysts for Selective Methane Conversion
Supported Ni-Cu Catalysts for the Selective Dehydrogenation of Liquid Organic Hydrogen Carriers
Surface Structure, Stability, and Catalytic Reactivity of Metal Nanoparticles Supported on Tantalum Oxide
CO Oxidation on Plasma-Activated Pd and PdAg Surfaces
Catalysis with Liquid Gallium Alloys
BREAK - Complimentary Coffee in Exhibit Hall
Ni as a Promotor for Ethylene Epoxidation: Computation, Surface Science, and Reactor Studies
Tuning Oxygen Activation on Gold with RhAu Single-Atom Alloys
Reaction Product and Single-Atom Promotion of Acetylene Cyclotrimerization and Cross-Coupling on Ag(111)
Selective Hydrogenation of Styrene to Ethylbenzene Over a Pd/Cu(111) Single Atom Alloy Surface
TF1-WeM
Thin-film and Redox-active Polyvinyl Metallocene via Chemical Vapor Deposition
Amine Functionalization of Polydioxanone at Low Temperature By oMLD of Poly(p-phenylenediamine)
oCVD Enabled Conjugated Polymer Alloying for Filler-Free High-Capacity Chloride Storage Cathodes
Rational Design of Fluoroalkyl-Free Liquid-Repellent Coatings Accessed via Photoinitiated Chemical Vapor Deposition (piCVD)
Designing Functional Polymer Thin Films via Initiated Chemical Vapor Deposition
Kinetically Defined Radical Queching Window for Area-Selective Photoinitiated Chemical Vapor Deposition (AS-PiCVD)
Development of Vapor-Imprinted Polymers for Food Spoilage Monitoring via Selective Acetoin Detection
BREAK - Complimentary Coffee in Exhibit Hall
TF2-WeM
Molecular Layer Deposition of Polyurea Film and their Role in Sidewall Passivation during Reactive Ion Etching in HF Plasmas
Realizing Controlled Porosity in Atomic Layer Deposited Metal Oxides
Coordination-Driven Ambient Infiltration of Silicon and Germanium Precursors for the Synthesis of Polymer–Inorganic Hybrid Materials
Negative-Tone PMMA-InOx Hybrid Resist Prepared by Sequential Infiltration Synthesis
TS-WeM
Utilizing the SI Redefinition and “NIST on a Chip” to Ensure Readiness Across the United States Air Force, Army, and Navy
Air Force Temperature Metrology and Photonic Thermometer Applications
The Standard Photonic Thermometer (SPoT) program at NIST
From SPRT Comparison to SI-traceable Photonic Thermometry with SPoT
Optical Frequency Comb Metrology for Assessing the Ultimate Stability of SPoT in a Water Triple-point (WTP) Cell
Dual Mode-Locked Comb Readout Method for Chip-Scale Silicon Photonic Thermometer
Developing Portable Tools for Photonic Thermometry
BREAK - Complimentary Coffee in Exhibit Hall
A Lighter Footprint: The Evolution of Ring-Resonator Thermometer Design at NRC
Chip-Based Photonic Thermometers: In-Situ Calibration and Si Traceability
Band-Edge Optical Microthermometers for Ultrahigh-Resolution Temperature Sensing
Quantitative Temperature Mapping with Nanometric Resolution
Sessions | Time Periods | Topics | Schedule Overview