AVS 70 Session EM+AIML+AP+QS+TF-WeM: Ferroelectrics and Memory Devices

Non-volatile memory (NVM) devices that reliably operate at temperatures above 300 °C are currently non-existent and remain a critically unmet challenge in the development of high- temperature (T) resilient electronics. There are numerous emerging harsh environment applications including aerospace, space exploration, oil and gas exploration, nuclear plants, mining and others that require complex, in-situ computing and sensing capabilities, for which high temperature NVM is critical. Current Silicon (Si)-based micro(nano)electronics, utilizing complementary metal oxide semiconductor (CMOS) technology, encounter reliability challenges above 200 °C and cannot retain their functional properties at high temperatures. Ferroelectric Al_xSc_1-xN exhibits strong potential for utilization in NVM devices operating at very high temperatures (> 500 °C) given its stable and high remnant polarization (P_R) above 100μC/cm² with demonstrated ferroelectric transition temperature (T_C) > 1000 °C. Here, we demonstrate an Al_0.68Sc_0.32N ferroelectric diode based NVM device that can reliably operate with clear ferroelectric switching up to 600 °C with distinguishable On and Off states. The coercive field (E_C) from the Triangle Wave I-V measurements is found to be -5.84 (E_C-) and +5.98 (E_C+) (+/- 0.1) MV/cm at room temperature (RT) and found to decrease with increasing temperature up to 600 °C. The devices exhibit high remnant polarizations (> 100 μC/cm²) which are stable at high temperatures. At 600 °C, our devices show 1 million read cycles with On-Off ratio above 1 for > 60 hours. Finally, the operating voltages of our AlScN ferrodiodes are < 15 V at 600 °C which is compatible with Silicon Carbide (SiC) based high temperature logic technology, thereby making our demonstration a major step towards commercialization of NVM integrated high-T computers. NVM characteristics of engineered ferrodiodes with higher On-Off ratios at > 600 °C will also be presented in the meeting.

^a Dhiren K. Pradhan and David C. Moore contributed equally to this work.

^*Authors to whom correspondence should be addressed: dmj@seas.upenn.edu.

Non-volatile Ferroelectric lead zirconium titanate (PZT) are interesting candidates for future memory applications but the fatigue resistance of the electrode material from the capacitors is a challenge. Iridium (Ir) is being investigated as electrode material for its superior characteristic. Thus, a patterning process must be developed. Due to the low volatility of the etch products, etching Ir is typically performed by ion beam etching (IBE). The low-throughput, relative scarcity of IBE chambers in the industry, as well as the limited tunability of the sputtering process are motivations for the development of a plasma-based etching approach.

In this work, we conducted experiments with TiN as a hard mask, following the process flow shown in Figure 1. Preliminary data indicates that Ir can be etched using both fluorine-based and chlorine-based gases. We identify and highlight the primary parameters affecting the Ir etch rate in the RIE process, focusing on gas flow rates, power settings, pressure, and substrate temperature. We also compare the relative contributions of physical and chemical reactions to the etch rate of Ir.

XSEM pictures for those experiments are shown in figures 2 and 3. It is observed that selectivity with a TiN hard-mask is a challenge when using these chemistries. Sidewall residues have also been observed in conditions where ion sputtering is dominant. Therefore, optimization of the etch processes based upon an understanding of the etch mechanisms in place is necessary.

Since the discovery of ferroelectricity in doped hafnia (HfO₂) and alloyed hafnia zirconia thin films (Hf,Zr)O₂ over a decade ago, fluorite-structure binary oxides have garnered great interest for use within ferroelectric memory devices to realize compute-in-memory (CiM) and neuromorphic applications. With conformal atomic layer deposition (ALD) techniques, process temperatures below 400 °C, coercive fields close to 1 MV/cm, and ferroelectricity down to ~ 1nm, hafnia thin films are ideal candidates for back-end-of-line (BEOL) integration with complementary metal oxide semiconductor (CMOS) circuits. Leveraging these qualities, recent research has extensively focused on charge-based hafnia devices, such as ferroelectric random access memory (FeRAM) and ferroelectric tunnel junctions (FTJs). FTJs are realized by sandwiching a 4-7nm ferroelectric between electrodes to form a metal-ferroelectric-metal (MFM) structure with a voltage-controlled resistance modulated by polarization. Thinner than FeRAM and able to generate multistate resistances, FTJs are poised to enable energy efficient CiM devices and artificial intelligence (AI) hardware accelerators with improved performance and small form factor.

The discovery of ferroelectricity in hafnium oxide based thin films has catalyzed significant research focused on understanding the ferroelectric property origins when fabricated in conventional metal-ferroelectric-metal geometries. Studies have revealed that electrode material selection impacts oxygen vacancies, interfacial layers, and biaxial stress, all noted responsible ferroelectric mechanisms. The coefficient of thermal expansion (CTE) incongruency between the hafnia and the electrode material induces an in-plane tensile stress following post-metallization annealing. However, recent work has shown that while the electrode material CTE does have an effect, the overall strain resulting from the device is primarily from the CTE of the silicon substrate and densification of the hafnia film during crystallization. This notwithstanding, comparisons between electrode materials have shown significant differences in ferroelectric remenant polarization (P_r) behavior. This work describes these polarization differences through the lens of the elastic modulus of the electrode material. TaN/HZO/TaN/M devices, where M is platinum, TaN, iridium, tungsten, and ruthenium, were fabricated using plasma enhanced atomic layer deposition and sputtering for the hafnia and metal layers, respectively. Wafer flexure measurements done using stylus profilometry revealed each metal electrode material was compressive as deposited. Two-dimensional X-ray diffraction, utilized to derive the sin²(ψ) in-plane biaxial stress in the HZO, revealed a strong correlation between stress and electrode elastic modulus (E). Further, Polarization-electric field (P(E)) measurements at 2.5 MV cm^-1 field also showed dependence of P­_r on measured E. Conversely, no correlation exists between the electrode CTE and P_r or biaxial stress, respectively. Increasing modulus results in a greater resistance to deformation of the electrode, which when deposited prior to annealing the HZO to crystallize from the amorphous state, restricts the out-of-plane expansion of the HZO, promoting the stabilization of the ferroelectric orthorhombic phase, in a phenomenon known as the “capping effect”. This work further promotes the acceleration integration of HZO into MFM devices, such a non-volatile memory devices.

Fast,compact, and power-efficient compute-in-memory (CIM) accelerators can move machine learning from data centers to edge compute devices, enabling training and inference to be done where the training data is collected. However, conventional accelerators that use vonNeumannarchitectureshave poor area and computationalpowerefficiency and longexecutionlatency.CIMarchitectureswithMultiplyAccumulateMacros(MAMs)canaddressthe power and performancelimitationsof approaches that use von Neumann hardware architectures. To date these MAM implementationshavebeenhinderedbythelargephysicalsizeofmemoryelementsandthehigh-powerconsumptionofsupportingcircuitry.The Defense Advanced Research Program Agency’s OptimumProcessingTechnologyInsideMemoryArrays(OPTIMA)programseekstodeveloparea-andpower-efficienthigh-performanceMAMswithinnovativesignalprocessingcircuits. The key technical challenges that performers are addressing include 1) developing area-efficient, multi-bit memory elements (i.e. 8 bits of storage in a 1T-1C structure) that can be incorporated into compact multiply compute elements (MCEs) and 2) achieving compact, scalable, and power-efficient MAM circuits. This presentation will provide an overview of the OPTIMA program goals and approaches to achieving those goals.

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AI and inference learning energy demands are on pace to surpass global energy production¹, but analog in-memory computing hardware can reduce the energy required by up to six orders of magitude². Electrochemical RAM (ECRAM) is a new and promising transistor technology to realize physical neuromorphic analog in-memory computing circuits, achieved on the device level by modifying a thin-film battery stack to measure the impedance of a selected electrode. The impedance is controlled by changing the state of charge of the battery, electrochemically doping the selected electrode with the electrochemically active species. ECRAM that utilizes protons as the electrochemically active species is compatible with existing CMOS devices, has faster programming speed and increased device durability compared to more established Lithium ion ECRAM. As a less well studied system, it is helpful to understand the insertion of protons in and out of the electrode of interest using a more traditional liquid cell before advancing to a solid-state system. In this presentation, the liquid cell electrochemical characteristics and degradation mechanisms in anatase TiO­₂ are discussed with and without a capping Nafion film. It is observed that the anatase TiO₂ electrode’s typically quick degradation is suppressed by adding a spin-cast Nafion film, increasing cyclability in an aqueous acetate buffer solution by >10x cycles and altering the H⁺ insertion kinetics. Subsequently, TiO₂ is used in an all-solid-state three electrode transistor by splitting the bottom current collector into a source-drain configuration and using PdH_x as the counter electrode and H⁺ reservoir. Results toward novel solid state anatase TiO₂ based protonic ECRAM are discussed with a focus on device state modulation by electrochemical doping.

[1] B. Bailey, “AI Power Consumption Exploding,” Semiconductor Engineering. Accessed: May 09, 2024. [Online]. Available: https://semiengineering.com/ai-power-consumption-exploding/

[2] E. J. Fuller et al., “Li-Ion Synaptic Transistor for Low Power Analog Computing,”Advanced Materials, vol. 29, no. 4, p. 1604310, 2017

Ferroelectric hafnium oxide (HfO₂) presents opportunities for technological developments in microelectronics, such as scaling of ferroelectric random-access memory (FeRAM) and new devices such as ferroelectric field-effect transistors (FeFETS) and ferroelectric tunnel junctions (FTJs), that were not previously possible with conventional ferroelectrics. This is due to its compatibility with silicon and ability to exhibit a ferroelectric response in films as thin as 1 nm. Understanding the interaction between radiation and HfO₂-based ferroelectrics is necessary before this material can be utilized in devices facing radiation-hostile environments. In this work, the effects of varying doses of gamma radiation (1 to 8 Mrad) on the structural and electrical properties of metal-ferroelectric-metal capacitors fabricated with 17 nm thick hafnium zirconium oxide (HZO) layers is investigated. Additionally different electrode materials, titanium nitride and tungsten, will be compared. Polarization-electric field, capacitance-voltage, and leakage current measurements were made after electric field cycling with voltages ranging from 2.6 to 4 V. It will be shown that the devices experience decreased endurance and a shift in the coercive voltage that scales with the applied gamma dose and depends on the electrode material. Synchrotron nano-Fourier transform infrared spectroscopy measurements demonstrated that no significant phase changes occur after radiation in these films. This work advances the understanding of the interaction between radiation and HfO₂-based ferroelectrics in order to probe the fundamental limits of radiation tolerance in this material.