Self-assembly is the spontaneous and reversible organization of components into ordered structures, representing an alternative to the conventional manufacture of systems made of components from milli to nano scales. First commercial applications of self-assembly have appeared in recent years, for example in the fabrication of radio frequency identification (RFID) tags.

However, the full impact of this new approach towards hetero system integration will only be realized once self-assembly can be programmed on demand. This presentation gives an overview of several projects that aim at programmable self-assembly. A key concept is the ³programmable surface² ­ an interface whose properties can be controlled with high spatial and temporal resolution. Several crucial topics are discussed: real time control of interfacial properties; optimization of binding site designs; and algorithms for the modeling and control of self-assembly. Promising novel manufacturing methods are emerging that combine the precision and reproducibility of semiconductor fabrication with the scalability and parallelism of stochastic self-assembly and with the specificity and programmability of biochemical processes.

liquid state (reflow), the free faces of the pattern fold upwards, out of the plane, to form the desired polyhedron. The wetting of solder with regards to coverage of metallic faces has been described previously, but the lateral bridging between the metal faces remains relatively unexplored. The goal of this work is to characterize the parameters influencing the bridging and folding process for two different ways of dip-soldering: face and edge soldering. Face soldering refers to the complete wetting of metal faces while edge soldering refers to selectively applying solder on the edges of a face that come in contact with other faces when folded. Our work explores bridging yield for various gap sizes and face thicknesses for eight different polyhedral patterns. Experiments show that the thickness and gap size strongly influence successful bridging. Experiments also show that improved control over the bridging process increases the yield of folded structures. In particular, gap size is positively correlated to face thickness for successful folding. Moreover, face soldering results in higher

yields than edge soldering for all patterns.

Graphene’s unparalleled strength, stiffness, and low mass per unit area make it an ideal material for nanoelectromechanical systems (NEMS), but graphene resonators have been challenging to fabricate in large numbers and have exhibited poor quality factor. Here, we present simple methods of fabricating large arrays of graphene resonators from CVD-grown graphene and discuss their properties. We focus on circular graphene resonators with diameter of up to 30 microns, for which we observe highly reproducible resonance frequencies and mode shapes, as well as a striking improvement in the membrane quality factor with increasing size. The largest graphene resonators display quality factors as high as 2400 ± 300, about an order of magnitude greater than previously observed quality factors for monolayer graphene. These measurements shed light on the mechanisms behind dissipation in monolayer graphene resonators and demonstrate that the quality factor of graphene resonators relative to their thickness is high compared to nanomechanical resonators demonstrated to date. We conclude by providing an outlook for graphene NEMS and their applications.

We have fabricated up to 1 mm diameter high tensile stress (1.2 GPa) circular SiN membranes. Stoichiometric amorphous high tensile stress SiN is a useful material for nanomechanical devices and resonators made from it have shown extremely high Q (> 1,000,000) at room temperature.¹ We used both optical and electron beam lithography to define circular structures and measured their resonant frequency and Q using optical interferometric detection methods. The measured mechanical Q shows a strong modal dependence, indicating the influence of clamping losses. Azimuthal harmonics of circular resonators with diameter s> 200 mm show an exponential drop in dissipation within an individual modal family (n = 1,2,3.., m) apparently due to the destructive interference between the waves radiated by adjacent sections of periphery.² However, still higher order modes of large resonators and modes of smaller resonators are strongly influenced by a characteristic fQ limit of 2 × 10¹³ possibly indicating the presence of intrinsic dissipation in the high frequency limit. These findings pave the way for identifying optimum high Q modes of stressed oscillators for applications in mass sensing and fundamental research in optomechanics.

1) D. Southworth et al, PRL, 2009

2) I. Wilson-Rae et al PRL, 2011

In this work we demonstrate robust flammable gas sensing using stress-based resonant microelectromechanical systems (MEMS) bridges at ambient pressure and temperature. In contrast to previously reported works, which were based on either measuring a static deflection or changes in frequency due to added mass, we report a method of tracking shifts in resonant frequency of microbridges in real time due to alteration of stress from swelling of a reactive polymer coating near the Euler buckling configuration. Experimental results clearly demonstrate that the suggested approach is efficient for selectively sensing trace vapor. We show projected vapor content sensitivity as low as ~13.4 ppm for ethanol vapor in low concentration regime, and demonstrate actualized proven sensitivity of less than 1 part per thousand, with a few seconds response time for the functionalized microbridge.

Nanoelectromechanical systems (NEMS) have exquisite potential in fields ranging from quantum measurement to ultrasensitive mass sensing. Signal transduction has remained an important challenge for NEMS where applications demand fast, parallel, sensitive, and low-noise drive and detection of motion in ever smaller and faster devices. The burgeoning field of nanooptomechanical systems (NOMS) has offered a promising solution to this challenge in the form of unprecedented displacement sensitivity with almost unlimited bandwidth. Nanophotonic circuits provide strong local concentration of optical forces and optical phase changes interacting with embedded NEMS devices. The combination is fully integratable with modern opto-electronic and semiconductor technology paving the way to large-scale-integrated lab-on-a-chip NEMS sensing arrays.