ALD2017 Sunday Afternoon

Atomic Layer Deposition of Silicon Dielectrics: Precursors, Processes and Plasmas

Atomic Layer Deposition of Carbon Doped Silicon Oxide by Precursor Design and Process Tuning

Evaluation of Silicon Precursors for Low Temperature Silicon Nitride Deposition

Atomic Layer Deposition of SiO₂ Using Tris(dimethylamino)Aminosilane Precursor and Ozone

In situ Infrared Absorption Study of Plasma-Enhanced ALD of Silicon Nitride using Di-sec-butylaminosilane and Bis(t-butylamino)silane on Silicon and Silicon Nitride Surfaces

First-Principles Understanding of Reaction Mechanisms in Plasma Enhanced Atomic Layer Deposition of Silicon Nitride

Atomic Layer Deposition of AlN from AlCl₃ using NH₃ and Ar/NH₃ Plasma as Co-reactant

Nanoscale Gettering of Excess O in CuO Nanowires via ALD Al₂O₃

Temperature Dependent Growth of Alumina on Tungsten Nano-Powder

Critical Aspects in Fluid Bed ALD

Super-Conformal Growth by ALD

Thin Film Conformality Profile Analysis with Microscopic All-Silicon Lateral High Aspect Ratio Structures

ALD onto Particles: Batch and Continuous Processes for Industry

Atomic Layer Processes to Enable the Atomic Scale Era

Thermal Atomic Layer Etching of SiO₂ by a “Conversion-Etch” Mechanism

The Challenges and Opportunities in Plasma Etching of Functionally Enhanced Complex Material Systems

A Novel Process for Atomic Layer Etching of ZnO using Acetylacetone and Remote O₂ Plasma

Determining the Benefits and Limitations of Atomic Layer Etching: A Modeling Investigation

ALE TBD 2

Significant Improvements of CD Uniformity and ARDE in ODL Mask Etching using a Self-limiting Cyclic Etch Approach

Nanometer-Scale III-V 3D MOSFETs

Atomic Layer Etch Processes Developed in an ICP/RIE Etching System for Etching III-V Compound Semiconductor Materials

Enhanced Thermal ALE of Aluminum Oxide Combined with ALD for UV Optical Applications

Area Selective Deposition Using Spatial ALD and Polymer Patterns

Area-selective ALD of Silicon Oxide using Acetylacetone as Inhibitor in a Three-step Cycle

Evaluation of Different Nanoimprint Resists for a use in Area-selective Atomic Layer Deposition of Selected Materials

Developing a Full Wafer-scale Approach Towards High ALD Selectivity on Copper vs Low-K (and Oxides) using a Single ALD/SAMS Platform

Fabrication of Large-area Nanolines by Area-selective Atomic Layer Deposition

Nanoscale Selective Deposition of TiO₂ using e-beam Patterned Polymeric Inhibition Layers and TDMAT Precursor

Area-selective Atomic Layer Deposition using Inductively Coupled Plasma Polymerized Fluorocarbon Layer: A Case Study for Metal-Oxides and Metals

Adventures and Advances in Selective Deposition

Direct-write ALD of Transparent Conductive Oxides: Micro- and Nanoscale Patterned In₂O₃:H and ZnO

Inherent Substrate-Selective Growth of Cobalt and Nickel Metal Films by Atomic Layer Deposition

Delayed Nucleation of HfO₂ and TiO₂ ALD on Carbon via Cyclic Plasma Treatments for Application in Selective-Area Deposition

Selective Deposition Process Combining PEALD and ALE

Plasma-enhanced Atomic Layer Deposition of Large-area MoS₂: From 2-D Monolayers to 3-D Vertical Fins

Low-Temperature Atomic Layer Deposition of MoS₂ Films

Dielectric-MoS₂ Interfaces Grown by Atomic Layer Deposition

Plasma-Enhanced Atomic Layer Deposition of sub-5 nm high- k Dielectrics on 2D Crystals

Novel in-situ Electrical Characterization of the Atomic Layer Deposition Process on 2D Transition Metal Dichalcogenides Transistors

Deposition of MoS₂ and WS₂ from bis(tert-butylimido)-bis(dialkylamido) Compounds and 1-Propanethiol

Direct Growth of Layered Boron Nitride Films on MoS₂ using Atomic Layer Deposition for 2D Based Nano-electronics

Fabrication of Functional Complex Nanostructures Based on Novel Atomic Layer Deposition Approach of Boron Nitride

When There is no Bulk: Growth and Structure of Dielectric and Semiconductor Oxide Nanolaminates

Perfecting Single-Crystal Ternary Perovskite YAlO₃ Epitaxial Growth on GaAs(111)A Utilizing Atomic Layer Deposited Sub-Nano-Laminated Y₂O₃/Al₂O₃

Thermal Coefficient of Resistance (TCR) Measurements for Atomic Layer Deposited Metal-Metal Oxide Nanocomposites

Phase Control of Ga₂O₃ Films Deposited by Atomic Layer Epitaxy

High Quality SiN and SiO₂ Films Produced by PEALD with Microwave ECR Plasma Below 200 ºC

Tertiary Butyl Hydrazine as a Reducing Agent for Low-Temperature Atomic Layer Deposition of Low-Resistivity Copper Thin Films