ICMCTF2004 Thursday Morning
Sessions | Time Periods | Topics | Schedule Overview
Hover over a paper or session to view details.
Click a Session in the first column to view session papers.
| Session | Thursday, April 22, 2004 | |||||||||||
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| 8:30 AM | 9:30 AM | 10:30 AM | 11:30 AM | |||||||||
| A1-1 |
Architectural Structure Changes In Atmospheric Plasma Spraying WCCo Coatings For Improving Corrosion Response
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Structural Analysis of AISI-SAE 4140 Steel Nitrided by Post-discharge Assisted Nitriding Process
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Sulphidation Behaviour of Siliconised Mo and Nb by Pack Cementation at 850°C
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The Influence of the Oxidation Behaviour on the Thermal Stability of Hard PVD Coatings.
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Relationship between Particle Erosion and Lamellar Microstructure for Plasma Sprayed Alumina Coatings
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Study of Pit Initiation on Ar Implanted Stainless Steel
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| A2 |
Low-temperature Thin-electrolyte Solid Oxide Fuel Cells
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YSZ Electrolyte Coatings on Porous Electrodes of Solid Oxide Fuel Cells Using Combustion Chemical Vapor Deposition
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Conductive Oxide Coatings on Ferritic Alloy for Solid Oxide Fuel Cell Interconnect Application
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High Temperature Oxidation Resistance and Surface Electrical Conductivity of Stainless Steels with Filtered Arc CrAlN Superlattice Multilayer Coatings
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| B1 |
Recent Developments in Pulsed Magnetron Sputtering
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A Simplified Treatment of Target Implantation Effects in Reactive Sputtering
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Plasma Diagnostical Comparison of the MSIP Process of (Ti,Al)N with Pulsed and DC Power Supplies using Energy Resolved Mass Spectroscopy
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Erosion Resistant Properties of Magnetron Sputtering Deposited Ti1-xAlxNy Coatings
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Deposition of CrN-MoS2 Thin Films by D. C. Magnetron Sputtering
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Elaboration and Characterization of Thin Films of ZrBN Deposited by Triode PVD Prossec
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Zirconia-metal Oxide Nanolaminate Films
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Pvd-Al2o3 Coated Cemented Carbide Cutting Tools
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Deposition of α-Alumina Hard Coatings by Reactive Magnetron Sputtering
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Nanostructured Nitride Films of Multi-element High-entropy Alloys by Reactive Sputtering
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| B10 |
The Interface TiN-Si3N4: a Model for the Bonding in Hard Nanocomposites
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Modelling Nitrogen Atom Flux in Post-discharge Nitriding Processes
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The Influence of Ion Implantation during Reactive Sputtering
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Parameter Analysis of Reactive Sputtering Process with Surface Kinetics and Plasma Chemistry
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Single Particle Impact Modeling in Multilayered PVD Coatings for Erosion Protection
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Composite Coatings for Mg Alloys Based on Oxide Ceramic Layers Produced using Plasma Electrolysis
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Optical Characteristics of Oxide Coatings on Aluminium Alloys Produced by Pulsed Bipolar Plasma Electrolysis
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Novel Hard and Wear Resistant Coatings on Aluminium Alloys Produced by Plasma Electrolytic Oxidation
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Oxide/lubricant Composite Coatings Deposited by using Electrolytic Plasma Process
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| E4-1 |
An Overview on the Tribological Behavior of DLC in Technical and Medical Applications
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Microstructure of Amorphous Diamond-like Carbon Thin Films and Changes during Wear
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Tribological Analysys of Amorphous Carbon Coatings for Valve Train Components
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Tribological Performance of DLC at Elevated Temperatures
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Effects of High-temperature Hydrogenation Treatment on Sliding Friction and Wear Behavior of Carbide-derived Carbon Films
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Tribological Characterization of Amorphous Hard Carbon (ta-C) Coating at Room Temperature; Effect of Counterbody Materials and Humidity
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Tribological Behavior of Diamond-like Carbon Films in Aqueous Environment
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Nano-impact Testing - an Effective Tool for Assessing the Resistance of Advanced Wear-resistant Coatings to Fatigue Failure and Delamination
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| H3-1 |
Ferroelectric Thin Films on Silicon Carbide for Next Generation Nonvolatile Memory and Sensor Devices
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A Modeling of the Optical Properties of Thin ZnO-ZnMgO Films in a Double Barrier-quantum Well Structure
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High Density Ge Quantum Dots Prepared by High-vacuum Ion-beam Sputtering
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New Metal Layers for Integrated Circuit Manufacture: Experimental and Modeling Studies
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Characterization of Hot Wall Epitaxy Grown AgGaTe2 Films on KCI Substrate
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Mechanism of High Density Plasma CVD Phosphosilicate Glass Process without In-situ Plasma Chamber Clean
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Oxide Mediated Epitaxy Salicide Formation on Different Dopant Type of Si Surface
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Investigation of Electro-plating Voltage Effect on the Copper Electrodeposition Technology
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Integration Solution for Dishing & Erosion Elimination in Copper Process beyond 0.13 um Technology
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