GOX 2023 Session HM-MoP: Heterogeneous Material Integration Poster Session I
Session Abstract Book
(241KB, Aug 7, 2023)
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HM-MoP-1 Characterization of Sputtered P-Type Nickel Oxide for Ga2O3 Devices
Joseph Spencer (Naval Research Laboratory); Yunwei Ma, Boyan Wang, Ming Xiao (Virginia Tech); Alan Jacobs, Jenifer Hajzus (Naval Research Laboratory); Alyssa Mock (Weber State University); Travis Anderson, Karl Hobart (Naval Research Laboratory); Yuhao Zhang (Virginia Tech); Marko Tadjer (Naval Research Laboratory) β-Ga2O3 is a promising UWBG (EG = 4.8 eV) material in the field of power electronics. However, the flat valence band of β-Ga2O3 has prevented the realization of p-Ga2O3. Without shallow acceptor dopants and p-type conductivity in β-Ga2O3, the ability to fabricate high power homojunction devices (PN and JBS diodes) with appropriate field mitigation (guard rings, JTE) is not possible. While other WBG materials such as SiC and GaN can be doped to form p-type conductivity, Ga2O3 must rely on a heterojunction. A heterojunction device often exhibits interface traps that negatively impact device performance. Nickel Oxide (NiO) is a cubic WBG (3.7 eV) p-type semiconductor [1] that is stable at room temperature and forms a favorable band offset to Ga2O3 [2]. Reactive ion sputtering is often used to deposit NiO thin films on Ga2O3; in our case, a NiO target was utilized to sputter at room temperature. Small changes in sputtering conditions and parameters such as deposition power and pressure, results in widely varying electrical and material properties of the NiO thin films, making characterization challenging. While accurate and repeatable values of NA can be challenging, a better understand is crucial for device fabrication. In this work we characterized room-temperature sputtered NiO thin films using electrical methods, ellipsometry, and X-ray photoelectron spectroscopy (XPS) in an attempt to understand the properties of the films. Variations in sputtering power, pressure, and oxygen partial pressure resulted in wide ranging electrical parameters. Most deposition conditions (Table I) result in low mobility (~1 cm2/(V·s) and high sheet resistance (kΩ/sq – MΩ/sq) making Hall effect characterization difficult. Instead, we used Hg probe CV measurements to estimate free hole concentration (p=NA), a critical parameter for device design (Fig 1). MOS capacitance structures and Hg probe CV show NA values ranging over two order of magnitude (1017-1019 cm-3) stemming from variations in the oxygen partial pressure. As more oxygen is forced into the NiO, the amount of nickel vacancies (Ni3+); the source of p-type conductivity, increases (Table 1). Other methods of NiO film characterization include ellipsometry and XPS. Ellipsometry is critical for investigating film quality, thickness, and band gap; while XPS has been used to observe the content of the Ni vacancies. We have also investigated ohmic contacts to NiO such as Ni, Pt, and PtOx (Fig. 2, Table 2), all of which produce Schottky contacts to Ga2O3. While p-type Ga2O3 remains unrealized, continued material research into NiO is critical for the advancement of Ga2O3 devices. View Supplemental Document (pdf) |