AVS 72 Friday Morning

Sessions | Time Periods | Topics | Schedule Overview

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Session Friday, November 13, 2026
8:15 AM 9:15 AM 10:15 AM 11:15 AM
AC-FrM
Environmental Radioactivity at the Department of Energy’s Hanford Site: Sources and Sinks
Reaching the Monolayer Limit in a van der Waals Actinide Magnet
Theory of High-Resolution X-Ray Absorption and Resonant Inelastic X-Ray Scattering: Focus on Intermediate Valency
Electronic Structure Studies of Tetravalent Actinides by Solid State NMR Spectroscopy
BREAK
High-Resolution X-ray Spectroscopic Studies on Protactinium and Actinium
Manufacturing to Performance: Advanced Characterization of Nuclear Fuels
Cooperative Phenomena in Locally Non-Centrosymmetric Heavy-Systems and Raman Effect in Cecosi
Statistical Enhancement of Fissile Isotope Discrimination via Superposition of Fission-Track Clusters
AIML1-FrM
Accelerating Discovery and Design for Thin Film Polymer Self-Assembly through Machine Learning
Autonomous Discovery of PFAS-Free Low Surface Energy Thin Films
AIML2-FrM
Process Informatics Framework for Optimizing Thin-Film Deposition in Advanced Semiconductor Manufacturing
Physics-Informed AI for Semiconductor Equipment Status Estimation and Process Quality Prediction: Equipment Manufacturer's Perspective
Multi-Objective Optimization of the Operational Durability of Meniscus-coated Perovskite Solar Cells
AIML3-FrM
In the Design of Thin Charge-Transport Films for Perovskite Solar Cells, Predictions from Machine Learning and Physics Only Partially Overlap
Closed-Loop Ai Workflow for Literature-Guided Perovskite Thin-Film Discovery
BREAK
Multimodal AI Meets Materials Characterization
Building Informative Materials Datasets Beyond Targeted Objectives
AIML4-FrM
Panel: Funding Agencies
AM1+
Machine Learning for Electronic Materials Discovery and Synthesis
Exploration of Limiting Factors for c-BN Growth by Ion-Beam Assisted Molecular Beam Epitaxy
Tuning the Physicochemical Properties of Polymer-like a-C:H Thin Films via Ultraviolet C (UV-C) Irradiation
Aerosol–Assisted CVD of NbN Using Novel Thermally Stable Niobium Imido Single–Source Precursors
Ta Doping in MBE Grown WSe2 2D Semiconductor
Multilinear Regression Modeling of SiO2 PECVD Deposition Based on Full Factorial Experiments
Transition Metal-Doped Sodium Niobate Thin Films: Microstructure, Ferroelectric Phase Stabilization, and Implications for Plasma-Assisted Catalysis
BREAK
AM2+
Development of Metallic Gate Stacks at Atomic Scale : Application to Advanced FD-SOI Transistors
Towards Ordered Growth of Complex Oxide Thin Films for Memristive Devices
Electron beam lithography enabled nano EC-RAM development and fabrication
Limitations of Layered Dielectrics
AP1+
Analyzing Plasma-Enhanced ALD of III-Nitrides via Experimental and Theoretical Studies
Optical Bandgap and Thermal Stability Driven High–κ Engineering of HfAlO Dielectrics on a 200 mm ALD Platform
Atomic Layer Deposition Metal and Barrier Layers Enabling Next Generation Interconnects
Tuning the Mechanical Properties of Silica Aerogels Using Atomic Layer Deposition
Multilayer FUV Coatings Using ALD-Grown LaF₃ and ZrF₄
Controlling the Crystallinity of V2O5 Deposited by Plasma-Enhanced Atomic Layer Deposition
Epitaxial Growth of VN on Si3N4(0001)/Si(111) Using Molecular Beam Epitaxy
BREAK
AP2+
Plasma-Enhanced ALD of SiO2 with an Alternative Precursor: From Mechanistic Insight to Area-Selective Deposition
Temperature-Dependent Growth Behavior of Aluminum Oxide Using Dimethylaluminum Isopropoxide and Water
Void-free Thermal ALD BaTiO3 Thin Films Prepared by Removing Water Dose after Ba Precursor
Optimizing Molybdenum Pentachloride Delivery for Vapor Deposition Processes
Atomic Layer Modulation of Ru-Ir Alloy Thin Films for Low-Resistivity Interconnect Applications
Pulsed Thermal Etching of Amorphous TiO2 Thin Films Using MoCl5
BT+
Grain Structure Control of Evaporated Li Metal Films for Optimized Solid State Batteries
Unravelling the Mechanism of Al2O3 Atomic Layer Deposition on Li6PS5Cl for All-Solid-State Batteries
Engineered Cathode Chemomechanics Enables Ultra-Low Stack Pressure Solid-State Batteries
Pulsed Laser Deposition of Solid Electrolytes: How Limited Thermal-Budget Processing Relates to Li-ion Conductivity
Open-Circuit Energy Band Alignment at NMC/LLZTO and LLZTO/Li Interfaces for Solid-State Microbattery Applications
LiPON-Enabled Reduction of V2O5 during Fabrication of Thin-Film Ionic Devices
BREAK
CA1-FrM
Semiconductor Manufacturing Metrology
High Performance Computing and Artificial Intelligence Enabled Materials Characterization and Experimental Automation
Challenges in Real-Time Plasma-Surface Diagnostics
Gaede Langmuir Award Talk: Investigation of Solid-Solid and Solid-Liquid Interfaces under Electrical Potential via XPS and EIS 
CA2-FrM
in Situ Molecular Imaging of Ion Clusters Reveals the Acid Gas Capture Capacity and Mechanism of Water-Lean Ionic Liquids
Modulating Active Site for Water Electrolysis
Synthesis and in Situ Characterization of Simulated Hanford Tank Waste Models in Aqueous Solution
Accessing Surfaces and Interfaces in the Modern Scientific Era: An Overview of Important Instrumentation Advances
Studying Electrified Catalysis at the Laboratory and at Synchrotron End Stations
Energy Flux from Non-Thermal Discharges Measured via Nanocalorimetry: Toward Plasma Standard Development
PK+
Advances Packaging Approaches for Chiplet Solutions
Advanced Packaging Enables the Future of the Semiconductor Industry
Heterogeneous Integration Enabled by Fanout Wafer Level Packaging Prototyping Facility and Activities at Arizona State University
Maskless Lithography for Wafer and Panel-Level Advanced Packaging: Enabling Adaptive Patterning Beyond Reticle Limits
Development of a Domestic Fan-Out Wafer-Level Packaging Platform for Advanced Heterogeneous Integration
SCAPEx: Status of Onshoring Secure 300mm Wafer Bumping and TSV Wafer Finishing
BREAK
On-Shore Sustainable Organic IC Substrate (ICS) Fabrication
Impact of Formic Acid Distribution on Fluxless Reflow: Enhancing Process Uniformity and Performance
Bilayer Liners for Through Glass Vias with PVD and ALD Deposited Seed Layer and Fully Copper Plated Vias
Thin Film Characterization and Mechanisms EnablingExtreme Laser Lift-off (LLO)
Plasma Surface Engineering for Low Distortion Wafer Bonding
PS-FrM
Low Energy Remote Plasma and Non-Plasma Methods for Highly Selective Etching of Advanced Nanodevices
A Novel Si Etch Chemistry for CFET Fin Definition
Creation and Recovery of Defects in Lead Zirconate Titanate Thin-Films introduced by Inductively Coupled Plasma Reactive Ion Etching
Plasma-Surface Interactions of Polyurea Deposited on SiO2 and SiNx with HF Plasmas
Long-Term Influence of Fluorine Containing Plasmas and Gases on Sapphire (Single-Crystal Al2O3) and Ni-Based Alloy Surfaces
Investigations of Oxygen-Containing Plasma Etching of Diamond
The Effect of Remote Ar Plasma Exposure on the Crystalline Structure of VO2
BREAK
SS-FrM
Real-Time Control of Interfacial Dynamics Enables Electrocatalytic C-H and C-C Bond Transformation and Fuel Formation
Exploring Non-Thiol DDQ Self-Assembly on Au(111) through Cyclic Voltammetry, AmbientSTM, and XPS
Substrate Electrochemical Inertness as a Prerequisite for Reliable Electrocatalytic Characterization: Cu-Doped CNT Films Assessed by SECCM
Atomic-Scale Investigation of Li/Ag(111) Interfaces: New Phases, Li-Ag Alloy Formation and Lithiophilicity
Tracking Conducting Oxygen Ions in Solid Oxide Fuel CellElectrolytes by NAP-XPS
Enhancing Hydrogen Evolution via Cation-Regulated Interfacial Proton Transfer on Single-Atom Catalysts
Translating Interfacial Ion Activity to Electrochemical Reactivity
BREAK
Caught in the Act: Correlating Chemical Transformations and Structural Evolution Under Reaction Conditions
The Importance of Interfacial Water for Achieving Long-Range Ordered Assemblies
Surface Hydration and Antifouling Activity of Zwitterionic Polymers
Energetics of Water and Methanol Adsorption on CO-Precovered Pt (111) Surfaces: Solvent - Adsorbate Interactions
VT-FrM
High Vacuum MEMS Devices – Advances in Vacuum Technology in Microscale
Cassini - A MEMS Pirani with Range of 9 Order of Magnitude
AVS History Committee-Sponsored Talk: From Mercury Columns to Quantum-Based Standards: The Evolution of Vacuum and Pressure Metrology at NIST
Fast, Optimal Readout of a Tethered Optomechanical Pressure Sensor
Recent Updates to the NIST Helium Leak Calibration Service
Sessions | Time Periods | Topics | Schedule Overview