AVS 72 Friday Morning
Sessions | Time Periods | Topics | Schedule Overview
Hover over a paper or session to view details.
Click a Session in the first column to view session papers.
| Session | Friday, November 13, 2026 | ||||||||||||||
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| 8:15 AM | 9:15 AM | 10:15 AM | 11:15 AM | ||||||||||||
| AC-FrM |
Environmental Radioactivity at the Department of Energy’s Hanford Site: Sources and Sinks
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Reaching the Monolayer Limit in a van der Waals Actinide Magnet
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Theory of High-Resolution X-Ray Absorption and Resonant Inelastic X-Ray Scattering: Focus on Intermediate Valency
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Electronic Structure Studies of Tetravalent Actinides by Solid State NMR Spectroscopy
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BREAK
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High-Resolution X-ray Spectroscopic Studies on Protactinium and Actinium
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Manufacturing to Performance: Advanced Characterization of Nuclear Fuels
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Cooperative Phenomena in Locally Non-Centrosymmetric Heavy-Systems and Raman Effect in Cecosi
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Statistical Enhancement of Fissile Isotope Discrimination via Superposition of Fission-Track Clusters
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| AIML1-FrM |
Accelerating Discovery and Design for Thin Film Polymer Self-Assembly through Machine Learning
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Autonomous Discovery of PFAS-Free Low Surface Energy Thin Films
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| AIML2-FrM |
Process Informatics Framework for Optimizing Thin-Film Deposition in Advanced Semiconductor Manufacturing
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Physics-Informed AI for Semiconductor Equipment Status Estimation and Process Quality Prediction: Equipment Manufacturer's Perspective
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Multi-Objective Optimization of the Operational Durability of Meniscus-coated Perovskite Solar Cells
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| AIML3-FrM |
In the Design of Thin Charge-Transport Films for Perovskite Solar Cells, Predictions from Machine Learning and Physics Only Partially Overlap
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Closed-Loop Ai Workflow for Literature-Guided Perovskite Thin-Film Discovery
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BREAK
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Multimodal AI Meets Materials Characterization
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Building Informative Materials Datasets Beyond Targeted Objectives
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| AIML4-FrM |
Panel: Funding Agencies
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| AM1+ |
Machine Learning for Electronic Materials Discovery and Synthesis
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Exploration of Limiting Factors for c-BN Growth by Ion-Beam Assisted Molecular Beam Epitaxy
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Tuning the Physicochemical Properties of Polymer-like a-C:H Thin Films via Ultraviolet C (UV-C) Irradiation
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Aerosol–Assisted CVD of NbN Using Novel Thermally Stable Niobium Imido Single–Source Precursors
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Ta Doping in MBE Grown WSe2 2D Semiconductor
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Multilinear Regression Modeling of SiO2 PECVD Deposition Based on Full Factorial Experiments
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Transition Metal-Doped Sodium Niobate Thin Films: Microstructure, Ferroelectric Phase Stabilization, and Implications for Plasma-Assisted Catalysis
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BREAK
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| AM2+ |
Development of Metallic Gate Stacks at Atomic Scale : Application to Advanced FD-SOI Transistors
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Towards Ordered Growth of Complex Oxide Thin Films for Memristive Devices
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Electron beam lithography enabled nano EC-RAM development and fabrication
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Limitations of Layered Dielectrics
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| AP1+ |
Analyzing Plasma-Enhanced ALD of III-Nitrides via Experimental and Theoretical Studies
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Optical Bandgap and Thermal Stability Driven High–κ Engineering of HfAlO Dielectrics on a 200 mm ALD Platform
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Atomic Layer Deposition Metal and Barrier Layers Enabling Next Generation Interconnects
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Tuning the Mechanical Properties of Silica Aerogels Using Atomic Layer Deposition
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Multilayer FUV Coatings Using ALD-Grown LaF₃ and ZrF₄
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Controlling the Crystallinity of V2O5 Deposited by Plasma-Enhanced Atomic Layer Deposition
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Epitaxial Growth of VN on Si3N4(0001)/Si(111) Using Molecular Beam Epitaxy
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BREAK
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| AP2+ |
Plasma-Enhanced ALD of SiO2 with an Alternative Precursor: From Mechanistic Insight to Area-Selective Deposition
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Temperature-Dependent Growth Behavior of Aluminum Oxide Using Dimethylaluminum Isopropoxide and Water
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Void-free Thermal ALD BaTiO3 Thin Films Prepared by Removing Water Dose after Ba Precursor
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Optimizing Molybdenum Pentachloride Delivery for Vapor Deposition Processes
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Atomic Layer Modulation of Ru-Ir Alloy Thin Films for Low-Resistivity Interconnect Applications
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Pulsed Thermal Etching of Amorphous TiO2 Thin Films Using MoCl5
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| BT+ |
Grain Structure Control of Evaporated Li Metal Films for Optimized Solid State Batteries
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Unravelling the Mechanism of Al2O3 Atomic Layer Deposition on Li6PS5Cl for All-Solid-State Batteries
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Engineered Cathode Chemomechanics Enables Ultra-Low Stack Pressure Solid-State Batteries
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Pulsed Laser Deposition of Solid Electrolytes: How Limited Thermal-Budget Processing Relates to Li-ion Conductivity
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Open-Circuit Energy Band Alignment at NMC/LLZTO and LLZTO/Li Interfaces for Solid-State Microbattery Applications
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LiPON-Enabled Reduction of V2O5 during Fabrication of Thin-Film Ionic Devices
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BREAK
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| CA1-FrM |
Semiconductor Manufacturing Metrology
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High Performance Computing and Artificial Intelligence Enabled Materials Characterization and Experimental Automation
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Challenges in Real-Time Plasma-Surface Diagnostics
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Gaede Langmuir Award Talk: Investigation of Solid-Solid and Solid-Liquid Interfaces under Electrical Potential via XPS and EIS
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| CA2-FrM |
in Situ Molecular Imaging of Ion Clusters Reveals the Acid Gas Capture Capacity and Mechanism of Water-Lean Ionic Liquids
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Modulating Active Site for Water Electrolysis
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Synthesis and in Situ Characterization of Simulated Hanford Tank Waste Models in Aqueous Solution
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Accessing Surfaces and Interfaces in the Modern Scientific Era: An Overview of Important Instrumentation Advances
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Studying Electrified Catalysis at the Laboratory and at Synchrotron End Stations
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Energy Flux from Non-Thermal Discharges Measured via Nanocalorimetry: Toward Plasma Standard Development
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| PK+ |
Advances Packaging Approaches for Chiplet Solutions
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Advanced Packaging Enables the Future of the Semiconductor Industry
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Heterogeneous Integration Enabled by Fanout Wafer Level Packaging Prototyping Facility and Activities at Arizona State University
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Maskless Lithography for Wafer and Panel-Level Advanced Packaging: Enabling Adaptive Patterning Beyond Reticle Limits
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Development of a Domestic Fan-Out Wafer-Level Packaging Platform for Advanced Heterogeneous Integration
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SCAPEx: Status of Onshoring Secure 300mm Wafer Bumping and TSV Wafer Finishing
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BREAK
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On-Shore Sustainable Organic IC Substrate (ICS) Fabrication
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Impact of Formic Acid Distribution on Fluxless Reflow: Enhancing Process Uniformity and Performance
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Bilayer Liners for Through Glass Vias with PVD and ALD Deposited Seed Layer and Fully Copper Plated Vias
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Thin Film Characterization and Mechanisms EnablingExtreme Laser Lift-off (LLO)
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Plasma Surface Engineering for Low Distortion Wafer Bonding
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| PS-FrM |
Low Energy Remote Plasma and Non-Plasma Methods for Highly Selective Etching of Advanced Nanodevices
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A Novel Si Etch Chemistry for CFET Fin Definition
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Creation and Recovery of Defects in Lead Zirconate Titanate Thin-Films introduced by Inductively Coupled Plasma Reactive Ion Etching
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Plasma-Surface Interactions of Polyurea Deposited on SiO2 and SiNx with HF Plasmas
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Long-Term Influence of Fluorine Containing Plasmas and Gases on Sapphire (Single-Crystal Al2O3) and Ni-Based Alloy Surfaces
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Investigations of Oxygen-Containing Plasma Etching of Diamond
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The Effect of Remote Ar Plasma Exposure on the Crystalline Structure of VO2
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BREAK
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| SS-FrM |
Real-Time Control of Interfacial Dynamics Enables Electrocatalytic C-H and C-C Bond Transformation and Fuel Formation
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Exploring Non-Thiol DDQ Self-Assembly on Au(111) through Cyclic Voltammetry, AmbientSTM, and XPS
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Substrate Electrochemical Inertness as a Prerequisite for Reliable Electrocatalytic Characterization: Cu-Doped CNT Films Assessed by SECCM
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Atomic-Scale Investigation of Li/Ag(111) Interfaces: New Phases, Li-Ag Alloy Formation and Lithiophilicity
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Tracking Conducting Oxygen Ions in Solid Oxide Fuel CellElectrolytes by NAP-XPS
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Enhancing Hydrogen Evolution via Cation-Regulated Interfacial Proton Transfer on Single-Atom Catalysts
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Translating Interfacial Ion Activity to Electrochemical Reactivity
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BREAK
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Caught in the Act: Correlating Chemical Transformations and Structural Evolution Under Reaction Conditions
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The Importance of Interfacial Water for Achieving Long-Range Ordered Assemblies
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Surface Hydration and Antifouling Activity of Zwitterionic Polymers
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Energetics of Water and Methanol Adsorption on CO-Precovered Pt (111) Surfaces: Solvent - Adsorbate Interactions
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| VT-FrM |
High Vacuum MEMS Devices – Advances in Vacuum Technology in Microscale
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Cassini - A MEMS Pirani with Range of 9 Order of Magnitude
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AVS History Committee-Sponsored Talk: From Mercury Columns to Quantum-Based Standards: The Evolution of Vacuum and Pressure Metrology at NIST
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Fast, Optimal Readout of a Tethered Optomechanical Pressure Sensor
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Recent Updates to the NIST Helium Leak Calibration Service
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