Advanced BEOL/Interconnect Etching and Advanced Memory and Patterning (PS+EM-TuA)
Tuesday, Oct 22 2019 2:20PM, Room A222
Moderated by: Hisataka Hayashi, Toshiba Memory Corporation; Kenji Maeda, Hitachi High Technologies America Inc.
Abstracts (Use Expand/Collapse icon in first column to see/hide details)
SchedulePaper #Invited TalkTitle
2:20 PMPS+EM-TuA-1BEOL Etch Challenges and Solutions for Advanced Process Nodes
3:00 PMPS+EM-TuA-3Enabling Fully Aligned Via for Advanced BEOL Nodes Scaling -Etch and Film Co-optimization
3:20 PMPS+EM-TuA-4Non-selective Silicon Oxide and Nitride Etch in Oxygen/Nitrogen-containing Fluorocarbon Plasmas
4:20 PMPS+EM-TuA-7Challenges in High-aspect-ratio Hole Etching for 3D Flash Memory
5:00 PMPS+EM-TuA-9Plasma Processing of Phase Change Materials
5:20 PMPS+EM-TuA-10Meeting the Challenges in Patterning Phase Change Material for Next Generation Memory Devices
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