Plasma-Enhanced Atomic Layer Etching (PS+2D+EM+SS+TF-ThA)
Thursday, Oct 24 2019 2:20PM, Room A226
Moderated by: Steven Vitale, MIT Lincoln Laboratory; Mingmei Wang, TEL Technology Center, America, LLC
Abstracts (Use Expand/Collapse icon in first column to see/hide details)
SchedulePaper #Invited TalkTitle
2:20 PMPS+2D+EM+SS+TF-ThA-1Atomic Layer Etch: Real World Utilization of an Idealized Solution
3:00 PMPS+2D+EM+SS+TF-ThA-3Mechanism of SiN Etching Rate Fluctuation in Atomic Layer Etching
3:20 PMPS+2D+EM+SS+TF-ThA-4Effect of Polymerization on Ar+ Bombardment Modification of SiO2 and Si3N4 Substrates: Molecular Dynamics Simulation Study
4:00 PMPS+2D+EM+SS+TF-ThA-6Advanced Cyclic Plasma Etch Approaches for Metal Patterning: Synergy and Surface Modification Effects
4:40 PMPS+2D+EM+SS+TF-ThA-8Surface Modification and Stability of Plasma-assisted Atomic-layer Etching (ALE) of Si based Materials; Analysis by Molecular Dynamics (MD) Simulation
5:00 PMPS+2D+EM+SS+TF-ThA-9Innovative Future Etch Technology by Atomic-order Control
1
Page size:
 6 items in 1 pages